Resistor and method for making same

1. A metal strip resistor, comprising:

a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate;

first and second photolithographically formed terminations overlaying the metal strip; and

an adhesion layer between each of the first and second photolithographically formed terminations and the metal strip.

2. The metal strip resistor of claim 1 , further comprising an insulating material overlaying the metal strip between the first and second terminations.

3. The metal strip resistor of claim 2 wherein the insulating material comprises a polyimide.

4. The metal strip resistor of claim 2 wherein the insulating material is on both a top side of the metal strip and an opposite bottom side of the metal strip.

5. The metal strip resistor of claim 4 wherein the first and second terminations are on the top side of the metal strip and further comprise a pair of terminations on the bottom side of the metal strip.

6. The metal strip resistor of claim 1 wherein the metal strip is a metal alloy comprising at least one of nickel, chromium, aluminum, manganese, and copper.

7. The metal strip resistor of claim 1 wherein the adhesion layer comprises copper, titanium, and tungsten.

8. The metal strip resistor of claim 1 wherein the metal strip resistor is an 0402 size (1.0 mm by 0.5 mm) chip resistor.

9. The metal strip resistor of claim 1 further comprising plating on each of the first and second terminations.

10. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate, the method comprising:

applying an adhesion layer to the metal strip;

coating a photolithographic film onto the metal strip and adhesion layer;

applying a photolithographic process to form a conductive pattern in the photolithographic film defining first and second terminations; and

electroplating the conductive pattern.

11. The method of claim 10 , further comprising adjusting resistance of the metal strip.

12. The method of claim 11 wherein the adjusting resistance is performed by removing material from the metal strip, using at least one of: a laser, a punch tool, or a chemical etching process.

13. The method of claim 11 further comprising singulating the metal strip resistor.

14. The method of claim 10 wherein the adhesion layer comprises copper, titanium, and tungsten.

15. The method of claim 10 wherein coating the photolithographic film onto the metal strip comprises coating the photolithographic film to a first side of the metal strip and coating the photolithographic film to a second side of the metal strip and wherein the photolithographic process is applied to both the first side and the second side to form a four terminal resistor.

16. The method of claim 10 wherein the electroplating the conductive pattern includes electroplating the conductive pattern with gold.

17. The method of claim 10 further comprising applying an insulating material overlaying the metal strip between the first and second terminations, wherein the insulating material is comprised of a silicone polyester.

18. The method of claim 10 wherein the insulating material is applied using a blade.

19. The method of claim 10 wherein the conductive pattern comprises copper.

20. The method of claim 10 further comprising the step of plating the first and second terminations.