Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
A method of manufacturing a semiconductor device includes: pre-treating a surface of a substrate by supplying an oxygen-containing gas and a hydrogen-containing gas to the substrate heated in a process chamber under a pressure less than atmospheric pressure; and forming a film on the pre-treated substrate by performing a cycle a predetermined number of times. The cycle includes: supplying a precursor gas to the substrate in the process chamber; and supplying a reaction gas to the substrate in the process chamber.
1. A method of manufacturing a semiconductor device, the method comprising:
pre-treating a surface of a substrate by supplying an oxygen-containing gas and a hydrogen-containing gas to the substrate heated in a process chamber under a pressure less than atmospheric pressure to generate an oxidation species containing oxygen but no water; and
after pre-treating the surface of the substrate, forming a film on the pre-treated substrate by performing a cycle a predetermined number of times, the cycle including: supplying a precursor gas to the substrate in the process chamber; and supplying a reaction gas to the substrate in the process chamber,
wherein the act of pre-treating includes forming an oxide layer on the surface of the substrate by oxidizing the surface of the substrate by using the oxidation species, and
wherein a percentage concentration of the hydrogen-containing gas to the oxygen-containing gas and the hydrogen-containing gas (the hydrogen-containing gas/(the oxygen-containing gas+the hydrogen-containing gas)) is set to be within a range of 2 to 20%.
2. The method of claim 1 , wherein the act of supplying the reaction gas includes supplying an oxygen-containing gas and a hydrogen-containing gas, as the reaction gas, to the substrate heated in the process chamber under the pressure less than atmospheric pressure, and the act of forming the film includes forming an oxide film, as the film, on the pre-treated substrate.
3. The method of claim 2 , wherein process conditions when the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of pre-treating are set to be different from process conditions when the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of forming the film.
4. The method of claim 2 , wherein a time duration for which the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of pre-treating is set to be different from a time duration for which the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of forming the film.
5. The method of claim 2 , wherein a time duration for which the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of pre-treating is set to be longer than a time duration for which the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of forming the film.
6. The method of claim 2 , wherein a concentration of the hydrogen-containing gas to the oxygen-containing gas and the hydrogen-containing gas when the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of pre-treating is set to be different from a concentration of the hydrogen-containing gas to the oxygen-containing gas and the hydrogen-containing gas when the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of forming the film.
7. The method of claim 2 , wherein a concentration of the hydrogen-containing gas to the oxygen-containing gas and the hydrogen-containing gas when the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of pre-treating is set to be equal to or less than a concentration of the hydrogen-containing gas to the oxygen-containing gas and the hydrogen-containing gas when the oxygen-containing gas and the hydrogen-containing gas are supplied to the substrate in the act of forming the film.
8. The method of claim 2 , wherein the thickness of the oxide film is equal to or less than 10 nm.
9. The method of claim 1 , wherein the thickness of the oxide layer is 0.01 to 1 nm.
10. The method of claim 1 , wherein silicon is exposed on the surface of the substrate before the act of pre-treating is performed.
11. The method of claim 1 , wherein the film contains at least one selected from a group consisting of a semiconductor element and a metal element.
12. The method of claim 1 , wherein the film includes at least one selected from a group consisting of a SiO film, a SiN film, a SiON film, a SiCN film, a SiOCN film, a SiOC film, a SiBCN film and a SiBN film.
13. The method of claim 1 , wherein the reaction gas includes at least one selected from a group consisting of an oxygen-containing gas, a nitrogen-containing gas, a carbon-containing gas and a boron-containing gas.