Integrated circuit assembly with cushion polymer layer
A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.
1. A method of forming an integrated circuit assembly, comprising:
forming an insulator layer on a preliminary semiconductor assembly comprising a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side, the insulator being formed on the second side and an end of the conductive via,
forming a polymer layer on the insulator layer;
removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer; and
forming a conductive contact on the polymer layer and the end of the conductive via.
2. The method of claim 1 , wherein the polymer has a curing temperature in a range from about 260 degrees Celsius to about 320 degrees Celsius, and the method further comprises curing the polymer at a temperature in the range from about 260 degrees Celsius to about 320 degrees Celsius.
3. The method of claim 1 , further comprising:
forming an adhesive layer on the semiconductor circuitry layer; and
forming a handle layer on the adhesive layer,
wherein the curing temperature of the polymer layer is less than a breakdown temperature of the adhesive layer.
4. The method of claim 1 , wherein removing the quantity of polymer layer sufficient to expose the end of the conductive via includes chemical-mechanical polishing of the polymer layer.
5. The method of claim 1 , wherein the polymer layer is photoimageable polybenzoxazole.
6. The method of claim 1 , wherein the conductive via is formed to extend outward from the second side of the silicon substrate, the insulator layer formed over covering a surface of the conductive via, and
removing the quantity of the polymer layer sufficient to expose the end of the conductive via includes removing a portion of the conductive via that extends outward from the second surface of the silicon substrate.
7. The method of claim 6 , wherein the conductive via is formed to extend outward from the second surface of the silicon substrate by deep reactive-ion etching of the silicon substrate.
8. The method of claim 1 , wherein:
the insulator layer is a hard dielectric formed by plasma-enhanced chemical vapor deposition; and
the polymer layer is compliant relative to a hardness of the insulator layer.
9. The method of claim 1 , wherein forming the conductive contact on the polymer layer comprises forming multiple wiring layers in the polymer layer.
10. The method of claim 9 , wherein forming the multiple wiring layers in the polymer layer comprises:
forming a first polymer addition layer around the end of the conductive via such that the end of the conductive via is located in a recess formed in the polymer layer;
filling the recess with a conductor;
forming a conductive wiring layer on the conductor; and
patterning a second polymer addition layer onto the wiring layer to expose a portion of the conductive wiring layer,
wherein the conductive contact is formed on the exposed portion of the conductive wiring layer.