IP Library Granted Patent US 9,459,182
Granted Patent B2
US 9,459,182 · App. 14/234,469 · Granted Oct 4, 2016

Microchip and particle analyzing apparatus

Inventors: Yuji Akiyama (Tokyo, JP); Shoji Akiyama (Tokyo, JP); Takeshi Yamasaki (Tokyo, JP)
Assignee: Sony Corporation
G01N1/00B01L3/0268B01L3/502776G01N15/1484G01N21/01B01L3/502707B01L2200/0652B01L2200/12B01L2300/0816B01L2300/0887B01L2400/0433B01L2400/0487G01N2015/149
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Quick Facts
Patent No.
US 9,459,182
App. No.
14/234,469
Granted
Oct 4, 2016
Kind
B2
Abstract

There is provided a microchip including a flow channel, an ejection portion, and a cutout portion. The flow channel is configured to convey a fluid therein. The ejection portion includes an opening directed toward an end face of a substrate layer, and the ejection portion is configured to eject the fluid flowing through the flow channel to outside. The substrate layer is laminated to each other. The cutout portion is formed between the opening of the ejection portion and the end face of the substrate layer. The cutout portion has a larger diameter than that of the opening.

Claims (29)

1. A microchip comprising:

a flow channel configured to convey a fluid therein;

an ejection portion including an opening directed toward an end face of a substrate layer, the ejection portion configured to eject the fluid flowing through the flow channel to outside, and

a cutout portion formed between the opening of the ejection portion and the end face of the substrate layer, the cutout portion having a larger diameter than that of the opening of the ejection portion,

wherein at least a portion of the cutout portion is provided at the end face of the substrate layer.

2. The microchip according to claim 1 , further comprising:

a connection portion, having a straight line shape for connecting the flow channel to the ejection portion.

3. The microchip according to claim 2 , wherein

the substrate layer is formed by injection molding.

4. The microchip according to claim 3 , wherein

the substrate layer is laminated by thermocompression bonding.

5. The microchip according to claim 4 , wherein

the cutout portion has a width of 0.2 millimeters or more in corresponding with a distance between the opening of the ejection portion and the end face of the substrate layer.

6. The microchip according to claim 5 , wherein

the microchip is configured to be used in a particle analyzing apparatus.

7. The microchip according to claim 1 , wherein an opening of the cutout portion includes an octagonal prism shape.

8. The microchip according to claim 1 , further comprising a suction channel, wherein the suction channel is connected with the flow channel via a communicating port.

9. The microchip according to claim 1 , further comprising a tapered portion, wherein the tapered portion is provided between the flow channel and the communicating port.

10. A particle analyzing apparatus comprising:

a microchip, an optical detector and a pair of electrodes,

wherein the microchip includes

a flow channel configured to convey a fluid therein;

an ejection portion including an opening directed toward an end face of a substrate laver, the ejection portion configured to eject the fluid flowing through the flow channel to outside, and

a cutout portion formed between the opening of the ejection portion and the end face of the substrate laver, the cutout portion having a larger diameter than that of the opening of the ejection portion,

wherein at least a portion of the cutout portion is provided at the end face of the substrate layer.

11. The particle analyzing apparatus according to claim 10 , wherein an opening of the cutout portion includes an octagonal prism shape.

12. The particle analyzing apparatus according to claim 10 , wherein the optical detector includes a laser light source, an irradiation system and a detection system.

13. The particle analyzing apparatus according to claim 10 , further comprising a vibrating device, wherein the vibrating device is configured to vibrate the microchip.

14. The particle analyzing apparatus according to claim 10 , further comprising a ground electrode, wherein the ground electrode is provided between the cutout portion and the pair of electrodes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2014
From: AKIYAMA, YUJI; AKIYAMA, SHOJI; YAMASAKI, TAKESHI
To: SONY CORPORATION
Reel/Frame 032139/0107 →
Priority Claims (1)
JP 2011-169726 · Aug 3, 2011 · national
Continuity (1)
Related Publication 20140174206A1 · Jun 26, 2014