Carrier device, electrical device having a carrier device and method for producing same
View Patent ↗A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and/or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer.
1. An electrical device comprising:
a carrier device comprising:
a carrier comprising an electrically insulating layer; and
an electrical contact layer overlying the electrically insulating layer,
wherein the electrical contact layer comprises a ridge-shaped contact region, and
wherein a recess is arranged in the electrically insulating layer at least at one side surface of the ridge-shaped contact region or wherein the ridge-shaped contact region has a ridge width that decreases toward the electrically insulating layer; and
an electrical component electrically and mechanically connected to the ridge-shaped contact region, wherein the electrical and mechanical connection is formed by a bonded connection.
2. The electrical device according to claim 1 , wherein a recess is arranged in the electrically insulating layer at least at one side surface of the ridge-shaped contact region.
3. The electrical device according to claim 2 , wherein the ridge-shaped contact region has a ridge width that decreases toward the electrically insulating layer.
4. The electrical device according to claim 1 , wherein the ridge-shaped contact region has a ridge width that decreases toward the electrically insulating layer.
5. The electrical device according to claim 1 , wherein the ridge-shaped contact region is arranged between two recesses or two partial regions of the recess, which adjoin side surfaces of the ridge-shaped contact region.
6. The electrical device according to claim 1 , wherein the ridge-shaped contact region, apart from one side, is surrounded on all sides by one or a plurality of recesses.
7. The electrical device according to claim 1 , wherein the electrical contact layer comprises two ridge-shaped contact regions, which are arranged in a manner directed toward one another and between which the recess is formed in the electrically insulating layer.
8. The electrical device according to claim 1 , wherein the electrical contact layer comprises a further contact region which is electrically insulated from the ridge-shaped contact region, and wherein the recess is arranged in the electrically insulating layer between the ridge-shaped contact region and the further contact region.
9. The electrical device according to claim 1 , wherein the at least one side surface of the ridge-shaped contact region is slightly etched or undercut by etching.
10. The electrical device according to claim 1 , wherein the carrier device is embodied as a circuit board, as a metal core circuit board, as a ceramic carrier, as a glass carrier, as a glass ceramic carrier or as an anodically oxidized carrier.
11. The electrical device according to claim 1 , wherein the electrical component and the carrier device have different coefficients of thermal expansion.
12. The electrical device according to claim 1 , wherein the electrical contact layer of the carrier device comprises a further contact region that is electrically insulated from the ridge-shaped contact region, wherein the recess is arranged in the electrically insulating layer between the ridge-shaped contact region and the further contact region, and wherein the electrical component is electrically and mechanically connected to the further contact region.
13. The electrical device according to claim 1 , wherein the electrical component comprises a light-emitting semiconductor chip embodied as a flip-chip and the electrical device comprises a light-emitting device.
14. The electrical device according to claim 1 , wherein the bonded connection is formed by soldering or sintering.
15. A method for producing an electrical device, the method comprising:
(A) providing a carrier comprising an electrically insulating layer;
(B) forming an electrical contact layer over the electrically insulating layer, the electrical contact layer having a ridge-shaped contact region;
(C) forming a recess in the electrically insulating layer by at least partly removing the electrically insulating layer at least at one side surface of the ridge-shaped contact region or forming a ridge width of the ridge-shaped contact region which decreases toward the electrically insulating layer; and
(D) bonding an electrical component electrically and mechanically to at least one ridge-shaped contact region.
16. The method according to claim 15 , wherein step (C) comprises performing an etching method.
17. The method according to claim 16 , wherein the etching method comprises wet-chemical etching or ion etching.
18. The method according to claim 16 , wherein the electrical contact layer is slightly etched or undercut by etching in a region of the ridge-shaped contact region.
19. The method according to claim 15 , wherein step (C) comprises laser processing or embossing.
20. A carrier device for an electrical component, the carrier device comprising:
a carrier comprising an electrically insulating layer; and
an electrical contact layer on the electrically insulating layer,
wherein the electrical contact layer comprises at least one ridge-shaped contact region,
wherein at least one recess is arranged in the electrically insulating layer at least at one side surface of the ridge-shaped contact region,
wherein the ridge-shaped contact region has a ridge width that decreases toward the electrically insulating layer, and
wherein the carrier device is embodied as a circuit board, a metal core circuit board, a ceramic carrier, a glass carrier, a glass ceramic carrier or an anodically oxidized carrier.