Systems and methods for forming apertures in microfeature workpieces
Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.
1. A method for forming an aperture in a microfeature workpiece, the method comprising:
positioning the microfeature workpiece between a laser and an electromagnetic radiation sensor;
directing a laser beam from the laser toward the microfeature workpiece to form a first hole in the microfeature workpiece while the microfeature workpiece is positioned between the laser and the electromagnetic radiation sensor;
determining a number of pulses of the laser beam and/or an elapsed time to form the first hole by sensing when the laser beam passes through the microfeature workpiece with the sensor;
determining a desired depth for a second hole in the microfeature workpiece; and
automatically controlling the laser beam to form a plurality of second holes based on the determined number of pulses and/or the determined elapsed time, a depth of the first hole, and the desired depth of the second hole.
2. The method of claim 1 wherein the first hole is a test aperture and the second hole is a production aperture, and wherein the method further comprises forming a plurality of production apertures by controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form the test aperture.
3. The method of claim 1 wherein:
the microfeature workpiece includes a first surface and a second surface opposite the first surface; and
the method further comprises supporting the microfeature workpiece with a workpiece carrier so that a center region of the first surface and a center region of the second surface do not contact the workpiece carrier while directing the laser beam.
4. The method of 1 wherein the first hole is a through aperture and the second hole is a bling aperture, and wherein the method further comprises:
determining a number of pulses of the laser beam and/or an elapsed time to form the through aperture; and
controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a plurality of blind apertures in the microfeature workpiece.
5. The method of claim 1 wherein the first hole is a test through aperture and the second hole a production through aperture, and wherein the method further comprises:
determining a number of pulses of the laser beam and/or an elapsed time to form the test through aperture; and
controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a plurality of production through apertures in the microfeature workpiece.
6. The method of claim 1 , further comprising supporting the microfeature workpiece by engaging a perimeter edge of the workpiece with a workpiece carrier.