IP Library Granted Patent US 9,513,548
Granted Patent B2
US 9,513,548 · App. 14/242,957 · Granted Dec 6, 2016

Radiation-sensitive resin composition, method for forming resist pattern, polymer and polymerizable compound

Inventors: Yuusuke Asano (Tokyo, JP); Mitsuo Satou (Tokyo, JP); Hiromitsu Nakashima (Tokyo, JP); Kazuki Kasahara (Tokyo, JP); Yoshifumi Oizumi (Tokyo, JP); Masafumi Hori (Tokyo, JP); Takanori Kawakami (Tokyo, JP); Yasuhiko Matsuda (Tokyo, JP); Kazuo Nakahara (Tokyo, JP)
Assignee: JSR CORPORATION
G03F7/0392C08F20/22G03F7/0046G03F7/038G03F7/0388G03F7/30G03F7/2041
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Quick Facts
Patent No.
US 9,513,548
App. No.
14/242,957
Granted
Dec 6, 2016
Kind
B2
Abstract

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R 1 represents an alkali-labile group. A represents an oxygen atom, —NR′—, —CO—O— # or —SO 2 —O— ## , wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R′ represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R 1 .

Claims (68)

1. A radiation-sensitive resin composition comprising:

a first polymer comprising an acid-labile group;

an acid generator to generate an acid upon exposure to radiation; and

a second polymer comprising a fluorine atom and a repeating unit shown by formula (c2-1),

the second polymer having a fluorine atom content higher than a fluorine atom content of the first polymer, and being in an amount of 0.1 to 20 parts by mass based on 100 parts by mass of the first polymer,

wherein

n is an integer from 1 to 3,

X 1 represents a single bond, a difluoromethylene group, or a linear or branched perfluoroalkylene group having 2 to 20 carbon atoms,

R 2 represents a single bond, a divalent chain hydrocarbon group having 1 to 10 carbon atoms, or a divalent cyclic hydrocarbon group having 4 to 20 carbon atoms, wherein each R 2 is a same as or different from each other when n is 2 or 3,

R 3 represents an (n+1)-valent hydrocarbon group having 1 to 20 carbon atoms, wherein, optionally, an oxygen atom, a sulfur atom, an imino group, a carbonyl group, —CO—O—, or —CO—NH— is bonded to an end of R 3 which is bonded to R 2 ,

R represents a hydrogen atom, a methyl group, or a trifluoromethyl group,

R 8 represents a fluorine-substituted hydrocarbon group having 1 to 10 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, wherein each R 8 is a same as or different from each other when n is 2 or 3, and

R 8 and the CO group bonded to R 8 taken together are an alkali-labile group, wherein the alkali-labile group is a group that is separable to form a polar functional group in a presence of an alkali.

2. The radiation-sensitive resin composition according to claim 1 , wherein the second polymer further comprises a repeating unit shown by formula (c3) or a repeating unit shown by formula (c4),

wherein

R is a same as defined for the formula (c2-1),

G represents a single bond, an oxygen atom, a sulfur atom, —CO—O—, —SO 2 —O—NH—, —CO—NH—, or —O—CO—NH—, and

R 4 represents a fluorine-substituted chain hydrocarbon group having 1 to 6 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, or a fluorine-substituted cyclic hydrocarbon group having 4 to 20 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, and

wherein

m is an integer from 1 to 3,

R is a same as defined for the formula (c2-1),

A represents an oxygen atom or —CO—O— # , wherein the oxygen atom represented by A is not bonded directly to an aromatic ring, a carbonyl group which is not included in R 7 , or a sulfoxyl group, “#” indicates a bonding hand bonded to R 7 , and each A is either a same as or different from each other when m is 2 or 3,

R 7 represents a hydrogen atom or an acid-labile group, wherein each R 7 is either a same as or different from each other when m is 2 or 3,

R 6 is a same as defined for R 2 in the formula (c2-1), wherein each R 6 is either a same as or different from each other when m is 2 or 3,

R 5 is a same as defined for R 3 in the formula (c2-1), and

X 2 is a same as defined for X 1 in the formula (c2-1), wherein each X 2 is either a same as or different from each other when m is 2 or 3.

3. A method for forming a resist pattern comprising:

applying the radiation-sensitive resin composition according to claim 1 on a substrate to provide a resist film on the substrate;

exposing the resist film by applying radiation to the resist film via a mask pattern; and

developing the exposed resist film to form a resist pattern.

4. The method according to claim 3 , wherein the resin film is exposed via an immersion liquid provided over the resist film.

5. The radiation-sensitive resin composition according to claim 1 , wherein the second polymer has the fluorine content higher than the fluorine content of the first polymer by 1 mass % or more.

6. The radiation-sensitive resin composition according to claim 1 , wherein the second polymer has the fluorine content higher than the fluorine content of the first polymer by 5 mass % or more.

7. A radiation-sensitive resin composition comprising:

a first polymer comprising an acid-labile group;

an acid generator to generate an acid upon exposure to radiation; and

a second polymer comprising a fluorine atom and a repeating unit shown by formula (c2-2),

the second polymer having a fluorine atom content higher than a fluorine atom content of the first polymer, and being in an amount of 0.1 to 20 parts by mass based on 100 parts by mass of the first polymer,

wherein

X l represents a single bond, a difluoromethylene group, or a linear or branched perfluoroalkylene group having 2 to 20 carbon atoms,

R 2 represents a single bond, a divalent chain hydrocarbon group having 1 to 10 carbon atoms, or a divalent cyclic hydrocarbon group having 4 to 20 carbon atoms,

R 31 represents a divalent chain hydrocarbon group having 1 to 10 carbon atoms or a divalent cyclic hydrocarbon group having 4 to 20 carbon atoms, wherein, optionally, an oxygen atom, a sulfur atom, an imino group, a carbonyl group, —CO—O—, or —CO—NH—is bonded to an end of R 31 which is bonded to R 2 ,

R represents a hydrogen atom, a methyl group, or a trifluoromethyl group, and

R 9 is an alkali-labile group and represents a group shown by formula (1), formula (2) or formula (3), wherein the alkali-labile group is a group that is separable to form a polar functional group in a presence of an alkali,

wherein R 10 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an acyl group having 1 to 10 carbon atoms, or an acyloxy group having 1 to 10 carbon atoms, wherein each R 10 is either a same as or different from each other when a plurality of R 10 are present,

m 1 is an integer from 0 to 5,

m 2 is an integer from 0 to 4, and

each of R″ and R 12 independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, or R″ and R 12 bond to each other to form an alicyclic hydrocarbon group having 4 to 20 carbon atoms together with the carbon atom bonded to R 11 and R 12 .

8. The radiation-sensitive resin composition according to claim 7 , wherein the second polymer further comprises a repeating unit shown by formula (c3) or a repeating unit shown by formula (c4),

wherein

R is a same as defined for the formula (c2-2),

G represents a single bond, an oxygen atom, a sulfur atom, —CO—O—, —SO 2 —O—NH—, —CO—NH—, or —O—CO—NH—, and

R 4 represents a fluorine-substituted chain hydrocarbon group having 1 to 6 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, or a fluorine-substituted cyclic hydrocarbon group having 4 to 20 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, and

wherein

m is an integer from 1 to 3,

R is a same as defined for the formula (c2-2),

A represents an oxygen atom or —CO—O— # , wherein the oxygen atom represented by A is not bonded directly to an aromatic ring, a carbonyl group which is not included in R 7 , or a sulfoxyl group, “#” indicates a bonding hand bonded to R 7 , and each A is either a same as or different from each other when m is 2 or 3,

R 7 represents a hydrogen atom or an acid-labile group, wherein each R 7 is either a same as or different from each other when m is 2 or 3,

R 6 is a same as defined for R 2 in the formula (c2-2), wherein each R 6 is either a same as or different from each other when m is 2 or 3,

R 5 represents an (n+1)-valent hydrocarbon group having 1 to 20 carbon atoms, wherein, optionally, an oxygen atom, a sulfur atom, an imino group, a carbonyl group, —CO—O—, or —CO—NH— is bonded to an end of R 3 which is bonded to R 2 , and

X 2 is a same as defined for X 1 in the formula (c2-2), wherein each X 2 is either a same as or different from each other when m is 2 or 3.

9. A method for forming a resist pattern comprising:

applying the radiation-sensitive resin composition according to claim 7 on a substrate to provide a resist film on the substrate;

exposing the resist film by applying radiation to the resist film via a mask pattern; and

developing the exposed resist film to form a resist pattern.

10. The method according to claim 9 , wherein the resin film is exposed via an immersion liquid provided over the resist film.

11. The radiation-sensitive resin composition according to claim 7 , wherein the second polymer has the fluorine content higher than the fluorine content of the first polymer by 1 mass % or more.

12. The radiation-sensitive resin composition according to claim 7 , wherein the second polymer has the fluorine content higher than the fluorine content of the first polymer by 5 mass % or more.

Assignments (2)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
Priority Claims (3)
JP 2009-218175 · Sep 18, 2009 · national
JP 2009-235763 · Oct 9, 2009 · national
JP 2010-080744 · Mar 31, 2010 · national
Continuity (3)
Continuation 13420618 · Mar 15, 2012
Continuation PCTJP2010066216 · Sep 17, 2010
Related Publication 20140212813A1 · Jul 31, 2014