IP Library Granted Patent US 9,360,627
Granted Patent B2
US 9,360,627 · App. 14/254,173 · Granted Jun 7, 2016

Method and apparatus providing compensation for wavelength drift in photonic structures

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Quick Facts
Patent No.
US 9,360,627
App. No.
14/254,173
Granted
Jun 7, 2016
Kind
B2
Abstract

A method and apparatus are described which provide for wavelength drift compensation in a photonic waveguide by application of an electric field to a waveguide having a strained waveguide core.

Claims (45)

1. An optical structure comprising:

a waveguide resonator comprising an optical input , an optical output, and a waveguide having a resonant wavelength, the waveguide comprising a strained waveguide core over a lower cladding and an upper cladding disposed over the waveguide core;

a thermo-optic compensating material on the upper cladding, wherein the thermo-optic compensating material has a negative thermo-optic coefficient and the waveguide core material has a positive thermo-optic coefficient; and

at least a pair of electrodes electrically coupled to the waveguide resonator for providing an electric field which changes the resonant wavelength of the waveguide resonator.

2. An optical structure as in claim 1 , wherein at least a portion of the cladding has a thermal coefficient of expansion different from that of the waveguide core.

3. An optical structure as in claim 1 , wherein the strain in the strained waveguide core is produced by at least a portion of the at least one cladding.

4. An optical structure as in claim 1 , further comprising:

a control device for applying a voltage to the electrodes to change the resonant wavelength of the waveguide resonator.

5. An optical structure as in claim 4 , wherein the control device is coupled to a temperature sensor for detecting a temperature affecting the waveguide resonator; and develops a voltage, based on a sensed temperature, which is applied to the electrodes.

6. An optical structure as in claim 5 , further comprising a temperature set point device coupled to the control device for developing a voltage for setting a wavelength set point.

7. An optical structure as in claim 4 , wherein the control device is coupled to a wavelength detector for detecting a wavelength of the waveguide resonator, and developing a voltage based on a detected wavelength, which is applied to the electrodes.

8. An optical structure as in claim 7 , further comprising a wavelength set point device coupled to the control device for setting a wavelength set point.

9. An optical structure as in claim 5 , wherein the resonant wavelength of the waveguide resonator occurs at a first operating temperature and the control device applies a voltage to the electrodes which changes the value of the resonant wavelength in accordance with temperature deviations from the first operating temperature.

10. An optical structure as in claim 4 , wherein the control device is on a common substrate with the waveguide resonator.

11. An optical structure as in claim 1 , wherein at least one of the lower cladding and upper cladding provides a strain to the waveguide core.

forming a waveguide core.

12. An opticial structure as in claim 11 , wherein the upper cladding provides a strain to the waveguide core material.

13. An optical structure as in claim 1 , wherein the waveguide core comprises one of Si, GaAs, InP, Si x Ge 1−x .

14. An optical structure as in claim 12 , wherein the upper cladding material comprises one of silicon nitride, SiO x N y ,a spin on dielectric, SiO 2 , TiO 2 , ZrO 2 , HfO 2 , and Al 2 O 3 .

15. An optical structure as in claim 1 , wherein the lower cladding comprises a silicon oxide.

16. An optical structure as in claim 15 , wherein the silicon oxide is part of a silicon on insulator structure.

17. An optical structure as in claim 1 , wherein a first one of the electrodes is below the lower cladding and a second one of the electrodes is over the upper cladding.

18. An optical structure as in claim 1 , further comprising a thermo-optic compensating cladding between at least one of the electrodes and the upper cladding.

19. An optical structure as in claim 1 , wherein a first one of the electrodes is electrically coupled to the upper cladding and a second one of the electrodes is electrically coupled to the upper cladding at a location spaced from the first one of the electrodes.

20. An optical structure as in claim 19 , further comprising a third electrode electrically coupled to the upper cladding at a location spaced from the first and second electrodes.

21. A method of forming an optical structure, the method comprising:

forming a waveguide resonator having an optical input and an optical output, and a waveguide by:

forming a waveguide core over a lower cladding material provided on a substrate;

forming an upper cladding over the waveguide core, wherein at least one of the upper and lower claddings produces a strain in the waveguide core; and

forming a thermo-optic compensating material on the upper cladding, wherein the thermo-optic compensating material has a negative thermo-optic coefficient and the waveguide core material has a positive thermo-optic coefficient; and

forming electrodes for applying an electric field to the waveguide core to change the operating resonant wavelength of the resonator structure.

22. A method of forming an optical structure as in claim 21 , further comprising:

forming a first electrode in electrical communication with the upper cladding material; and

forming a second electrode in electrical communication with at least one of the upper and lower cladding.

23. A method of forming an optical structure as in claim 22 , wherein the second electrode is in electrical communication with the upper cladding and is spaced from the first electrode.

24. A method of forming an optical structure as in claim 22 , wherein the second electrode is in electrical communication with the lower cladding.

25. A method of forming an optical structure as in claim 23 , further comprising forming a third electrode in electrical communication with the upper cladding and spaced from the first and second electrodes.

26. A method of forming an optical structure as in claim 21 , wherein the forming of an upper cladding comprises forming the upper cladding material over the waveguide core and heating the upper cladding and waveguide core to strain the waveguide core.

27. A method of forming an optical structure as in claim 21 , wherein the waveguide core comprises one of Si, GaAs, InP, Si x Ge 1−x .

28. A method of forming an optical structure as in claim 21 , wherein the upper cladding material comprises one of silicon nitride SiO x N y , a spin on dielectric, SiO 2 , TiO 2 , ZrO 2 , HfO 2 , and Al 2 O 3 .

29. A method of forming an optical structure as in claim 21 , further comprising forming a temperature sensor and a control device connected to the temperature sensor for controlling a voltage applied to the electrodes in response to detected changes in temperature.

30. A method of forming an optical structure as in claim 21 , further comprising forming a wavelength detector and a control device connected to the wavelength detector for controlling a voltage applied to the electrodes in response to detected changes in wavelength.

31. A method of forming an optical structure as in claim 29 , wherein the control device and waveguide resonator are formed on a common substrate.

32. A method of forming an optical structure as in claim 30 , wherein the control device and waveguide resonator are formed on a common substrate.

33. A method of forming an optical structure as in claim 21 , wherein the thermo-optic compensating material comprises one of a polymer and titanium oxide.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →