Integrated circuit packaging system with electrical interface and method of manufacture thereof

1. An integrated circuit packaging system comprising:

an isolated contact having a contact body, a side protrusion, and a contact protrusion, the side protrusion having a curved surface, the contact protrusion having a contact pad on a lower protrusion surface, an upper protrusion surface, and a protrusion sidewall;

a die paddle having a die paddle protrusion, the die paddle protrusion having a die paddle pad on a lower die protrusion surface, an upper die protrusion surface, and a die protrusion sidewall;

an integrated circuit die over the die paddle protrusion; and

an encapsulation on the integrated circuit die and partially covering the isolated contact, the contact pad and part of the contact body exposed from the encapsulation.

2. The system as claimed in claim 1 further comprising:

a substrate having a substrate contact; and

conductive material between the contact protrusion and the substrate contact, the conductive material covering only the substrate contact and the contact pad.

3. The system as claimed in claim 1 wherein the die paddle includes:

a die attach pad on a top surface of the die paddle;

a die paddle perimeter on the top surface of the die paddle; and

an isolation groove between the die attach pad and the die paddle perimeter in the top surface of the die paddle.

4. The system as claimed in claim 1 wherein the contact protrusion extends from a bottom surface of the isolated contact, with the upper protrusion surface along a perimeter region of the isolated contact and the protrusion sidewall along a perimeter region of the lower protrusion surface.

5. The system as claimed in claim 1 further comprising:

a bond pad over the contact protrusion; and

bond wires connecting the integrated circuit die and the bond pad.

6. The system as claimed in claim 1 further comprising:

a substrate having a substrate contact;

conductive material between the contact protrusion and the substrate contact, the conductive material covering only the substrate contact and the contact pad;

a bond pad over the contact protrusion;

bond wires connecting the integrated circuit die and the bond pad; and

wherein:

the contact protrusion extends from a lower surface of the isolated contact, with the upper protrusion surface along a perimeter region of the isolated contact and the protrusion sidewall along a perimeter region of the lower protrusion surface.

7. The system as claimed in claim 6 wherein the contact pad is formed from solder-wettable material.

8. The system as claimed in claim 6 further comprising a plurality of the isolated contact around the die paddle.

9. The system as claimed in claim 6 further comprising a flip chip connected to the isolated contact.

10. The system as claimed in claim 6 further comprising a die attach adhesive between a flip chip and the integrated circuit die.