Patent Assignment
Reel/Frame 039492/0956
Change of Name
Recorded: 2016-07-27
Pages: 5
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(8)
Integrated Circuit Package System Employing Wafer Level Chip Scale Packaging
Exposed Interconnect for a Package on Package System
Integrated Circuit Packaging System with Plated Leads and Method of Manufacture Thereof
Patent:
9,142,531 →
Application:
14/219,463 →
Integrated Circuit Packaging System with Package Stacking
Patent:
9,349,666 →
Application:
14/231,526 →
Integrated Circuit Packaging System with Electrical Interface and Method of Manufacture Thereof
Patent:
9,305,873 →
Application:
14/254,584 →
Integrated Circuit Packaging System with Molded Laser via Interposer and Method of Manufacture Thereof
Patent:
9,385,066 →
Application:
14/282,598 →
Integrated Circuit Packaging System with Routed Circuit Lead Array and Method of Manufacture Thereof
Patent:
9,299,644 →
Application:
14/285,601 →
Integrated Circuit System with Debonding Adhesive and Method of Manufacture Thereof
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Assignment of Assignor's Interest
Jul 22, 2016
From: PAGAILA, REZA ARGENTY; DO, BYUNG TAI; CHUA, LINDA PEI EE
To: STATS CHIPPAC LTD.
Reel/Frame 039231/0159 →
Assignment of Assignor's Interest
Jul 22, 2016
From: DO, BYUNG TAI; KUAN, HEAP HOE
To: STATS CHIPPAC LTD.
Reel/Frame 039235/0297 →
Assignment of Assignor's Interest
Jul 22, 2016
From: CAMACHO, ZIGMUND RAMIREZ; BATHAN, HENRY DESCALZO; TAY, LIONEL CHIEN HUI
To: STATS CHIPPAC LTD.
Reel/Frame 039227/0074 →
Assignment of Assignor's Interest
Jul 26, 2016
From: BAE, JOHYUN; YOON, IN SANG; CHOI, DAESIK
To: STATS CHIPPAC LTD.
Reel/Frame 039262/0879 →
Assignment of Assignor's Interest
Jul 26, 2016
From: YOON, IN SANG; YANG, DEOKKYUNG; SONG, SUNGMIN
To: STATS CHIPPAC LTD.
Reel/Frame 039262/0614 →
Assignment of Assignor's Interest
Jul 26, 2016
From: CHOI, WON KYOUNG; MARIMUTHU, PANDI CHELVAM
To: STATS CHIPPAC LTD.
Reel/Frame 039262/0808 →
Assignment of Assignor's Interest
Jul 26, 2016
From: DO, BYUNG TAI; TRASPORTO, ARNEL SENOSA; CAMACHO, ZIGMUND RAMIREZ
To: STATS CHIPPAC LTD.
Reel/Frame 039262/0285 →
Assignment of Assignor's Interest
Jul 26, 2016
From: DO, BYUNG TAI; TRASPORTO, ARNEL SENOSA; CHUA, LINDA PEI EE
To: STATS CHIPPAC LTD.
Reel/Frame 039262/0362 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Corrective Assignment to Correct the Name of the Second Assignee Previously Recorded on Reel 052972 Frame 0001. Assignor(S) Hereby Confirms the Deed of Release.
Dec 20, 2023
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD.
Reel/Frame 066123/0885 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →