Corrective Assignment to Correct the Name of the Second Assignee Previously Recorded on Reel 052972 Frame 0001. Assignor(S) Hereby Confirms the Deed of Release.

Recorded: 2023-12-20 Received: 2023-12-20 Pages: 27

Assignor

Executed: 2019-05-03

Assignees

STATS CHIPPAC, INC.

46429 LANDING PARKWAY, FREMONT, CA, 94538, UNITED STATES

STATS CHIPPAC PTE. LTD.

5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE

Covered Properties (5)

Coreless Integrated Circuit Packaging System and Method of Manufacture Thereof

Application: 14/214,765 →

Integrated Circuit Packaging System with Embedded Pad on Layered Substrate and Method of Manufacture Thereof

Application: 13/928,754 →

Integrated Circuit Packaging System with Interposer and Method of Manufacture Thereof

Application: 13/489,850 →

Integrated Circuit Packaging System with Island Terminals and Embedded Paddle and Method of Manufacture Thereof

Application: 13/187,505 →

Integrated Circuit Package System Employing Wafer Level Chip Scale Packaging

Application: 12/709,425 →