Integrated circuit package system employing wafer level chip scale packaging

1. An integrated circuit package system comprising:

a substrate with a first surface and a second surface, the second surface includes a polished surface for promoting adhesion of subsequent layers;

electrical conductors on the first surface of the substrate;

a protective coating directly on the second surface of the substrate, the protective coating is optically opaque, and the protective coating includes a coating material having high adhesion strength, durability, and temperature resistance for preventing delamination and for providing structural support for the substrate; and

a labeling film on the protective coating, the labeling film includes a curable film having releasable bond properties, a sidewall of the protective coat coplanar to both a sidewall of the substrate and a sidewall of the labeling film.

2. The system as claimed in claim 1 wherein:

the protective coating can include a film type of material.

3. The system as claimed in claim 1 wherein:

the protective coating is a curable type of material.

4. The system as claimed in claim 1 wherein:

the protective coating exhibits temperature resistance.

5. The system as claimed in claim 1 wherein:

the protective coating supports and protects the substrate.

6. The system as claimed in claim 1 wherein:

the labeling film includes an identification mark.

7. The system as claimed in claim 1 wherein:

the labeling film includes a reverse image mark or a direct image mark.

8. The system as claimed in claim 1 wherein the protective coating can include a spray coating, a roll coating, a curtain coating, a brush-type coating, or a spin coating.

9. The system as claimed in claim 1 wherein the releasable bond properties include a chemical releasable bond or a thermal releasable bond.

10. The system as claimed in claim 1 wherein:

the substrate has a thickness of one hundred micrometers or less.