Patent Assignment
Reel/Frame 039235/0297
Assignment of Assignor's Interest
Recorded: 2016-07-22
Pages: 3
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package System Employing Wafer Level Chip Scale Packaging
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Change of Name
Jul 27, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039492/0956 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Corrective Assignment to Correct the Name of the Second Assignee Previously Recorded on Reel 052972 Frame 0001. Assignor(S) Hereby Confirms the Deed of Release.
Dec 20, 2023
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD.
Reel/Frame 066123/0885 →