Patent Assignment
Reel/Frame 039262/0614
Assignment of Assignor's Interest
Recorded: 2016-07-26
Pages: 5
Assignors
YOON, IN SANG
Executed: 2011-06-13
YANG, DEOKKYUNG
Executed: 2011-06-13
SONG, SUNGMIN
Executed: 2011-06-13
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Molded Laser via Interposer and Method of Manufacture Thereof
Patent:
9,385,066 →
Application:
14/282,598 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.