Patent Assignment
Reel/Frame 039262/0879
Assignment of Assignor's Interest
Recorded: 2016-07-26
Pages: 5
Assignors
BAE, JOHYUN
Executed: 2011-09-23
YOON, IN SANG
Executed: 2011-09-23
CHOI, DAESIK
Executed: 2011-09-23
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Package Stacking
Patent:
9,349,666 →
Application:
14/231,526 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.