Integrated circuit packaging system with package stacking

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a base substrate;

applying a molded under-fill on the base substrate;

mounting an intermediate substrate on the molded under-fill;

forming a substrate contact extender through the molded under-fill, the substrate contact extender completely through the intermediate substrate;

mounting a coupling connector on the substrate contact extender;

mounting an intermediate integrated circuit mounted directly on the intermediate substrate, the intermediate integrated circuit between the coupling connector and another of the coupling connector; and

mounting a stack device directly on the coupling connector, the stack device suspended above the intermediate integrated circuit by the coupling connector.

2. The method as claimed in claim 1 wherein:

mounting the intermediate integrated circuit includes mounting an intermediate wire-bonded chip on the intermediate substrate; and

further comprising:

forming an intermediate encapsulation on the intermediate substrate and encapsulating the intermediate wire-bonded chip.

3. The method as claimed in claim 1 wherein:

mounting the intermediate integrated circuit includes mounting an intermediate flip chip on the intermediate substrate.

4. An integrated circuit packaging system comprising:

a base substrate;

a molded under-fill on the base substrate;

an intermediate substrate mounted on the molded under-fill;

a substrate contact extender formed through the molded under-fill, the substrate contact extender formed completely through the intermediate substrate;

a coupling connector mounted on the substrate contact extender;

an intermediate integrated circuit mounted directly on the intermediate substrate, the intermediate integrated circuit between the coupling connector and another of the coupling connector; and

a stack device mounted directly on the coupling connector, the stack device suspended above the intermediate integrated circuit by the coupling connector.

5. The system as claimed in claim 4 wherein:

the intermediate integrated circuit includes an intermediate wire-bonded chip mounted on the intermediate substrate; and

further comprising:

an intermediate encapsulation on the intermediate substrate and encapsulating the intermediate wire-bonded chip.

6. The system as claimed in claim 4 wherein:

the intermediate integrated circuit includes an intermediate flip chip on the intermediate substrate.