Integrated circuit packaging system with plated leads and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a sacrificial support having a cavity provided therein;

plating an L-plated lead in the cavity;

bonding a die in the cavity conductively connected to the L-plated lead;

encapsulating the L-plated lead and the die;

attaching a carrier support to the sacrificial support;

removing the sacrificial support; and

singulating the carrier support into an individual integrated circuit packaging system.

2. The method as claimed in claim 1 further comprising plating a plated die attach paddle on the bottom of the cavity.

3. The method as claimed in claim 1 wherein encapsulating the L-plated lead exposes only one vertical surface and a horizontal surface of the L-plated lead.

4. The method as claimed in claim 1 wherein:

encapsulating the L-plated lead exposes only one vertical surface of the L-plated lead; and

further comprising:

bonding a first module to the one vertical surface of the L-plated lead.

5. The method as claimed in claim 1 wherein:

encapsulating the L-plated lead exposes a horizontal surface of the L-plated lead; and

further comprising:

bonding a second module to the horizontal surface of the L-plated lead.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a sacrificial support having a cavity provided therein;

plating L-plated leads in the cavity;

bonding a die in the cavity conductively connected by wires to the L-plated leads;

encapsulating the L-plated leads and the die;

attaching a carrier support to the sacrificial support;

etching the sacrificial support; and

removing an integrated circuit packaging system from the carrier support.

7. The method as claimed in claim 6 further comprising:

plating a plated die attach paddle on the bottom of the cavity; and

attaching the die to the plated die attach paddle.

8. The method as claimed in claim 6 wherein encapsulating the L-plated leads exposes only one vertical surface and a horizontal surface on each of the L-plated leads.

9. The method as claimed in claim 6 wherein:

encapsulating the L-plated leads exposes only one vertical surface on each of the L-plated leads; and

further comprising:

solder bonding a first module only to the one vertical surface on each of the L-plated leads.

10. The method as claimed in claim 6 wherein:

encapsulating the L-plated lead exposes a horizontal surface on each of the L-plated leads; and

further comprising:

ball bonding a second module only to the horizontal surface on each of the L-plated leads.