Patent Assignment
Reel/Frame 039227/0074
Assignment of Assignor's Interest
Recorded: 2016-07-22
Pages: 5
Assignors
CAMACHO, ZIGMUND RAMIREZ
Executed: 2011-03-22
BATHAN, HENRY DESCALZO
Executed: 2011-03-22
TAY, LIONEL CHIEN HUI
Executed: 2011-03-22
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Plated Leads and Method of Manufacture Thereof
Patent:
9,142,531 →
Application:
14/219,463 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.