Patent Assignment
Reel/Frame 039262/0285
Assignment of Assignor's Interest
Recorded: 2016-07-26
Pages: 5
Assignors
DO, BYUNG TAI
Executed: 2011-05-04
TRASPORTO, ARNEL SENOSA
Executed: 2011-05-04
CAMACHO, ZIGMUND RAMIREZ
Executed: 2011-05-04
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Routed Circuit Lead Array and Method of Manufacture Thereof
Patent:
9,299,644 →
Application:
14/285,601 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.