Patent Assignment
Reel/Frame 039262/0808
Assignment of Assignor's Interest
Recorded: 2016-07-26
Pages: 7
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit System with Debonding Adhesive and Method of Manufacture Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.