IP Library › Granted Patent US 9,382,625
Granted Patent B2
US 9,382,625 · App. 14/267,865 · Granted Jul 5, 2016

Remote plasma source based cyclic CVD process for nanocrystalline diamond deposition

Inventors: Jun Xue (San Jose, CA); Jingjing Liu (Santa Clara, CA); Yongmei Chen (San Jose, CA); Ludovic Godet (Boston, MA); Chentsau Ying (Cupertino, CA); Shambhu N. Roy (San Jose, CA)
Assignee: APPLIED MATERIALS, INC.
C23C16/56C23C16/272C23C16/45557C23C16/46C23C16/505
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,382,625
App. No.
14/267,865
Granted
Jul 5, 2016
Kind
B2
Abstract

Methods for making a nanocrystalline diamond layer are disclosed herein. A method of forming a layer can include activating a deposition gas comprising an alkane and a hydrogen containing gas at a first pressure, delivering the activated deposition gas to the substrate at a second pressure which is less than the first pressure, forming a nanocrystalline diamond layer, treating the layer with an activated hydrogen containing gas to remove one or more polymers from the surface and repeating the cycle to achieve a desired thickness.

Claims (55)

1. A method for depositing a layer, comprising:

performing a deposition process comprising:

delivering a deposition gas to a remote plasma chamber at a first pressure, the deposition gas comprising:

an alkane precursor; and

a hydrogen containing precursor;

activating the deposition gas to create an activated deposition gas, the activated deposition gas having a ratio of radical species to ionized species;

delivering the activated deposition gas through a second volume having a second pressure, the second pressure being less than the first pressure, wherein the ratio of radical species to ionized species increases in favor of the radical species,

delivering the activated deposition gas to a substrate in a process volume, the process volume having a third pressure, the third pressure being less than the second pressure; and

depositing a nanocrystalline diamond layer on a surface of the substrate, the nanocrystalline diamond layer having an upper surface with polymers formed thereon;

etching polymers from the upper surface of the nanocrystalline diamond layer; and

repeating the performing the deposition process and the etching polymers from the upper surface to deposit a nanocrystalline carbon stack of a desired thickness.

2. The method of claim 1 , wherein the first pressure is between about 10 Torr and about 100 Torr.

3. The method of claim 1 , wherein the substrate is maintained at a temperature range of between about 500 degrees Celsius and about 650 degrees Celsius.

4. The method of claim 1 , wherein the second pressure is between about 1 Torr and about 5 Torr.

5. The method of claim 1 , wherein the third pressure is between about 500 mTorr and about 1 Torr.

6. The method of claim 1 , wherein the deposition gas is activated using an RF source.

7. The method of claim 6 , wherein the RF source provides power between about 1000 W and 3000 W.

8. The method of claim 1 , wherein the polymers are etched from the upper surface using a hydrogen plasma.

9. The method of claim 1 , wherein the surface of the substrate is preseeded.

10. The method of claim 1 , wherein the alkane is methane.

11. A method for depositing a layer, comprising:

performing a deposition process comprising:

delivering a deposition gas to a remote plasma chamber at a first pressure, the deposition gas comprising:

an alkane precursor; and

a hydrogen containing precursor;

activating the deposition gas to create an activated deposition gas, the activated deposition gas having a ratio of radical species to ionized species;

delivering the activated deposition gas through a second volume having a second pressure, the second pressure being less than the first pressure;

delivering the activated deposition gas to a substrate in a process volume, the process volume having a third pressure, the third pressure being less than the second pressure; and

depositing a nanocrystalline diamond layer on a surface of the substrate, the nanocrystalline diamond layer;

performing a hydrogen plasma cleaning process, comprising:

delivering a hydrogen containing gas to a remote plasma chamber;

activating the hydrogen containing gas to create an activated hydrogen containing gas; and

delivering the activated hydrogen containing gas to the substrate in the process volume; and

repeating the performing of the deposition process and the hydrogen plasma cleaning process to deposit a nanocrystalline carbon stack of the desired thickness.

12. The method of claim 11 , wherein the first pressure is between about 10 Torr and about 100 Torr.

13. The method of claim 12 , wherein the second pressure is between about 1 Torr and about 5 Torr.

14. The method of claim 13 , wherein the third pressure is between about 500 mTorr and about 1 Torr.

15. The method of claim 11 , wherein the substrate is maintained at a temperature range of between about 500 degrees Celsius and about 650 degrees Celsius.

16. The method of claim 11 , wherein the deposition gas is activated using an RF source, and wherein the RF source provides power between about 1000 W and 3000 W.

17. The method of claim 11 , wherein the delivery of the activated deposition gas transitions to the delivery of the activated hydrogen containing gas without interruption in gas flow.

18. The method of claim 11 , wherein the surface of the substrate is preseeded.

19. The method of claim 11 , wherein the alkane is methane.

20. A method for depositing a layer, comprising:

positioning a substrate in the process volume of a processing chamber, the substrate having a preseeded surface;

heating the substrate to a temperature of less than 500 degrees Celsius;

performing a deposition process comprising:

delivering a deposition gas to a remote plasma chamber at a first pressure between 10 Torr and 100 Torr, the deposition gas comprising methane and hydrogen gas;

delivering RF power to activate the deposition gas, creating an activated deposition gas, the RF power being between 1000 W and 3000 W, the activated deposition gas having a ratio of radical species to ionized species;

delivering the activated deposition gas through a second volume having a second pressure between 1 Torr and 5 Torr;

delivering the activated deposition gas to a substrate in a process volume, the process volume having a third pressure between 500 mTorr and 1 Torr; and

depositing a nanocrystalline diamond layer on a surface of the substrate, the nanocrystalline diamond layer having sp2 bonds and sp3 bonds;

delivering the hydrogen gas in the absence of the methane to a remote plasma chamber;

activating the hydrogen gas to create an activated hydrogen gas;

delivering the activated hydrogen gas to a substrate in a process volume; and

repeating the performing of the deposition process to deposit a nanocrystalline carbon stack of the desired thickness.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2014
From: XUE, JUN; LIU, JINGJING; CHEN, YONGMEI; GODET, LUDOVIC; YING, CHENTSAU; ROY, SHAMBHU N.
To: APPLIED MATERIALS, INC.
Reel/Frame 034104/0769 →
Continuity (1)
Related Publication 20150315707A1 · Nov 5, 2015