MEMS jetting structure for dense packing
A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
1. A fluid ejector, comprising:
a fluid ejection module comprising a substrate having a plurality of fluid paths, each fluid path including a pumping chamber in fluid connection with a nozzle, and a plurality of fluid ejection elements, each fluid ejection element configured to cause a fluid to be ejected from a nozzle of an associated fluid path;
an integrated circuit interposer mounted on and electrically connected with the fluid ejection module; and
a flexible element electrically connected to the fluid ejection module, such that an electrical connection to the fluid ejection module enables a signal from the flexible element to the fluid ejection module to be transmitted to the integrated circuit interposer, processed on the integrated circuit interposer, and output to the fluid ejection module to drive at least one of the plurality of fluid ejection elements, wherein the integrated circuit interposer having a width that is smaller than a width of the fluid ejection module such that the fluid ejection module comprises a ledge, and the flexible element is attached to the ledge of the fluid ejection module, the ledge being adjacent to the integrated circuit interposer.
2. The fluid ejector of claim 1 , wherein the flexible element is formed on a plastic substrate.
3. The fluid ejector of claim 1 , wherein the flexible element is a flexible circuit.
4. The fluid ejector of claim 1 , further comprising a conductive material adjacent to and in electrical conductive communication with conductive elements on the flexible element and adjacent to and in electrical conductive communication with conductive elements on the fluid ejection module.
5. The fluid ejector of claim 1 , wherein the substrate includes silicon.
6. The fluid ejector of claim 3 , wherein a portion of an actuation layer of the fluid ejection module extends past the integrated circuit interposer to provide a ledge, and the flexible circuit is secured to the actuation layer in the ledge of the fluid ejection module.
7. The fluid ejector of claim 6 , wherein the integrated circuit interposer is narrower than the fluid ejection module.
8. The fluid ejector of claim 6 , wherein the flexible circuit is secured to a top surface of the actuation layer of the fluid ejection module.
9. The fluid ejector of claim 3 , wherein the fluid ejection module comprises a microfabricated die.
10. The fluid ejector of claim 9 , wherein a width of the flexible circuit is approximately equal to a length of the die.
11. The fluid ejector of claim 1 , wherein a thickness of the flexible circuit is between about 25 and 50 μm.