IP Library Granted Patent US 10,319,875
Granted Patent B2
US 10,319,875 · App. 14/269,348 · Granted Jun 11, 2019

Microelectronic workpiece processing systems and associated methods of color correction

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Quick Facts
Patent No.
US 10,319,875
App. No.
14/269,348
Granted
Jun 11, 2019
Kind
B2
Abstract

Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

Claims (42)

1. A system for processing a semiconductor substrate, comprising:

a substrate support configured to individually carry a microelectronic workpiece containing a plurality of light emitting diodes (LEDs);

a container holding a phosphor;

an injector operatively coupled to the container, the injector being configured to introduce a volume of the phosphor onto the plurality of LEDs of the microelectronic workpiece; and

a controller operatively coupled to the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising:

receiving a base emission characteristic of the plurality of LEDs of the microelectronic workpiece;

adjusting a characteristic of the phosphor based on a previously-performed measurement that generates a plurality of points in a chromaticity plot of the received base emission characteristic of the plurality of LEDs, and wherein each of the plurality of points is indicative of a set of parameters associated with the phosphor and the plurality of LEDs, and wherein the plurality of points together define a rectangular distribution area; and

introducing the phosphor with the adjusted characteristic onto the plurality of LEDs.

2. The system of claim 1 , further comprising a probe configured to measure the base emission characteristic of the plurality of LEDs of the microelectronic workpiece.

3. The system of claim 1 , further comprising a probe configured to measure the base emission characteristic of the plurality of LEDs of the microelectronic workpiece, wherein the method further includes:

organizing and storing the measured emission characteristic of the plurality of LEDs in an emission map; and

receiving a base emission characteristic includes receiving an emission characteristic from the emission map.

4. The system of claim 1 wherein:

receiving a base emission characteristic includes receiving an emission characteristic from an emission map stored in the computer-readable storage medium of the controller; and

adjusting the characteristic of the phosphor includes determining at least one of a composition and a concentration from a recipe database based on the received emission characteristic of the plurality of LEDs.

5. The system of claim 1 wherein:

receiving a base emission characteristic includes receiving an emission characteristic from an emission map stored in the computer-readable storage medium of the controller; and

adjusting the characteristic of the phosphor includes determining (1) at least one of a composition and a concentration of a first phosphor and a second phosphor; and (2) a ratio of the first and second phosphors from a recipe database based on the received emission characteristic of the plurality of LEDs.

6. The system of claim 1 , wherein the method further comprises adjusting the characteristic of the phosphor based on a target emission.

7. The system of claim 1 , wherein the container is a first container and the phosphor is a first phosphor, and wherein the system further comprises a second container holding a second phosphor.

8. The system of claim 7 , wherein the method further comprises introducing the first phosphor and the second phosphor, in a ratio, with the adjusted characteristic onto the plurality of LEDs.

9. The system of claim 8 , wherein the ratio includes at least one of a mass ratio, a molar ratio, and a volume ratio.

10. The system of claim 1 , wherein the base emission characteristic is measured based on an emission wavelength of the plurality of LEDs with a peak intensity.

11. A system for processing a semiconductor substrate, comprising:

a substrate support configured to individually carry a microelectronic workpiece containing a plurality of light emitting diodes (LEDs);

a container holding a phosphor;

an injector operatively coupled to the container, the injector being configured to introduce a volume of the phosphor onto the plurality of LEDs of the microelectronic workpiece; and

a controller operatively coupled to the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising:

receiving a base emission characteristic of the plurality of LEDs of the microelectronic workpiece;

developing a compensation scheme by selecting a group of candidate phosphors based on the base emission characteristic of the plurality of LEDs, wherein the group of the candidate phosphors is selected based on a previously-performed measurement that generates a plurality of points in a chromaticity plot of the received base emission characteristic of the plurality of LEDs, and wherein each of the plurality of points is indicative of a set of parameters associated with the phosphor and the plurality of LEDs, and wherein the plurality of points together define a rectangular distribution area;

adjusting a characteristic of the phosphor based on the compensation scheme; and

introducing the phosphor with the adjusted characteristic onto the plurality of LEDs.

12. The system of claim 11 , further comprising a probe configured to measure the base emission characteristic of the plurality of LEDs of the microelectronic workpiece.

13. The system of claim 11 , further comprising a probe configured to measure the base emission characteristic of the plurality of LEDs of the microelectronic workpiece, wherein the method further includes:

organizing and storing the measured emission characteristic of the plurality of LEDs in an emission map; and

receiving a base emission characteristic includes receiving an emission characteristic from the emission map.

14. The system of claim 11 wherein:

receiving a base emission characteristic includes receiving an emission characteristic from an emission map stored in the computer-readable storage medium of the controller; and

adjusting the characteristic of the phosphor includes determining at least one of a composition and a concentration from a recipe database based on the received emission characteristic of the plurality of LEDs.

15. The system of claim 11 wherein:

receiving a base emission characteristic includes receiving an emission characteristic from an emission map stored in the computer-readable storage medium of the controller; and

adjusting the characteristic of the phosphor includes determining (1) at least one of a composition and a concentration of a first phosphor and a second phosphor; and (2) a ratio of the first and second phosphors from a recipe database based on the received emission characteristic of the plurality of LEDs.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →