Substrate processing apparatus including spin chuck

1. A substrate processing apparatus comprising:

a spin chuck including a plurality of chuck pins disposed around a substrate, chuck opening/closing mechanisms that press the plurality of chuck pins onto a peripheral edge portion of the substrate to cause the plurality of chuck pins to grip the substrate in a horizontal posture, and a spin motor that rotates the substrate gripped by the plurality of chuck pins;

a processing liquid supply device that supplies a processing liquid to the substrate held by the spin chuck; and

a heat source disposed above the substrate which is held by the spin chuck, wherein

the plurality of chuck pins includes a plurality of conductive members and a plurality of pin covers corresponding to the plurality of conductive members respectively and spaced in a circumferential directions, and

each of the plurality of conductive members includes a gripping portion comprising a different material than the substrate for being pressable onto the peripheral edge portion of the substrate, and each of the plurality of conductive members is made of a material containing carbon, and each of the plurality of conductive members protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate, and

each of the plurality of the pin covers is a separate member from the plurality of conductive members, includes a pin covering portion that covers at least an upper surface of the gripping portion in a plan view, and covers, in a plan view, an entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate, and

the chuck opening/closing mechanisms move each conductive member together with corresponding pin cover between a closed position where the gripping portion is pressed onto the peripheral edge portion of the substrate and an open position where the gripping portion is separated from the peripheral edge portion of the substrate.

2. The substrate processing apparatus according to claim 1 , wherein

the heat source includes a lamp that emits light toward the substrate gripped by the spin chuck from an upper side of the substrate, and

each pin cover has a surface texture/roughness causing each pin cover to have an increased reflectivity.

3. The substrate processing apparatus according to claim 2 , wherein

each pin cover includes a white outer surface.

4. The substrate processing apparatus according to claim 1 , wherein

each of the pin covers includes a support portion that extends obliquely downward from the gripping portion and supports a lower surface peripheral edge portion of the substrate in a state where the gripping portion is separated from the peripheral edge portion of the substrate, and comprises a different material than the substrate.

5. The substrate processing apparatus according to claim 1 , wherein

the pin covering portion accommodates the gripping portion to cover at least the upper surface of the gripping portion in a plan view, and each pin cover defines an inward opening that extends inward from the gripping portion to an outside of the pin covering portion.

6. The substrate processing apparatus according to claim 5 , wherein

each pin cover defines an outward opening that extends outward from the gripping portion to the outside of the pin covering portion and continues to a gap between an inner surface of the pin covering portion and an outer surface of the gripping portion.

7. The substrate processing apparatus according to claim 6 , wherein

the outward opening is longer in an up and down direction than the gripping portion.

8. The substrate processing apparatus according to claim 6 , wherein

the outward opening is open outward and also open downward.

9. The substrate processing apparatus according to claim 1 , further comprising:

a control device that controls the spin chuck, the processing liquid supply device, and the heat source, wherein

the control device executes:

a liquid film forming step of causing the processing liquid supply device to supply the processing liquid to the substrate to form a liquid film of the processing liquid covering an entire upper surface of the substrate; and

a heating step of causing the heat source to generate heat in a state where the liquid film of the processing liquid formed in the liquid film forming step is placed on the substrate.

10. The substrate processing apparatus according to claim 1 , further comprising:

a control device that controls the spin chuck, the processing liquid supply device, and the heat source, wherein

the control device executes:

a processing liquid supplying step of causing the processing liquid supply device to supply the processing liquid to the substrate while causing the spin chuck to rotate the substrate;

a drying step of removing the processing liquid from the substrate by causing the spin chuck to rotate the substrate at a higher rotation speed than a rotation speed in the processing liquid supplying step in a state where supply of the processing liquid to the substrate is stopped, to dry the substrate; and

a heating step of causing the heat source to generate heat in parallel with the drying step.

11. The substrate processing apparatus according to claim 1 , wherein

each conductive member includes said gripping portion comprising said different material than the substrate for being pressable onto the peripheral edge portion of the substrate, and further includes a holding portion that comprises a different material than the gripping portion, and holds the gripping portion.