Semiconductor package and method
A first package is bonded to a second package with a structural member located between the first package and the second package for structural support. In an embodiment the structural member is a plate or one or more conductive balls. Once the structural member is in place, the first package is bonded to the second package.
1. A semiconductor device comprising:
a first package with a first side;
a second package with a second side facing the first side;
first external connections electrically connecting the first side of the first package and the second side of the second package; and
a structural member between the first package and the second package, wherein the structural member has a different dimension than the first external connections, wherein the structural member is not in contact with a contact pad of the first package.
2. The semiconductor device of claim 1 , wherein the structural member is a block.
3. The semiconductor device of claim 2 , wherein the block is a copper block.
4. The semiconductor device of claim 1 , wherein the structural member is a first solid ball.
5. The semiconductor device of claim 4 , wherein the first solid ball is a solder ball.
6. The semiconductor device of claim 4 , wherein the first external connections comprise a second solid ball, the second solid ball having a larger dimension than the first solid ball.
7. The semiconductor device of claim 1 , wherein the second package is an integrated fan out package.
8. A semiconductor device comprising:
a first package with a first side, the first package comprising a first semiconductor device;
first external connections connected to the first side;
a support member adjacent to the first side, the support member surrounded by the first external connections, wherein the support member is electrically isolated from the first semiconductor device; and
a second package with a second side facing the first side, the second side connected to the first external connections.
9. The semiconductor device of claim 8 , wherein the support member is a block.
10. The semiconductor device of claim 9 , wherein the block is a metal block.
11. The semiconductor device of claim 8 , wherein the support member is one or more solid balls.
12. The semiconductor device of claim 11 , wherein the one or more solid balls are solder balls.
13. The semiconductor device of claim 11 , wherein the first external connections are balls, and wherein the one or more solid balls are smaller than the first external connections.
14. The semiconductor device of claim 8 , wherein the second package is an integrated fan out package.
15. A method of manufacturing a semiconductor device, the method comprising:
forming a first external connection on a first side of a first package;
placing a structural member on the first side of the first package, wherein the structural member has a different dimension than the first external connection; and
bonding the first package to a second package such that the structural member is between the first package and the second package.
16. The method of claim 15 , wherein the first package is an integrated fan out package.
17. The method of claim 15 , wherein the placing the structural member places a metal block.
18. The method of claim 15 , wherein the placing the structural member places one or more solid balls.
19. The method of claim 18 , wherein the one or more solid balls have a smaller diameter than the first external connection.
20. The semiconductor device of claim 1 , wherein the second package is an integrated fan out package.