Vertical random access memory with selectors

1. A method of manufacturing a device comprising:

providing a substrate;

forming an inter-layer dielectric (ILD) layer over the substrate;

forming, on the ILD layer, a vertical structure having a plurality of memory with one or more selectors, the vertical structure is made of a plurality of conductive stacks, wherein a conductive stack of the plurality of conductive stacks is formed by

(a) forming first and second first type conductors on first and second sides of the conductive stack,

(b) providing a first memory element adjacent the first first type conductor and a second memory element adjacent the second first type conductor,

(c) forming first and second electrodes with the first electrode adjacent the first memory element and the second electrode adjacent the second memory element,

(d) forming a conductor layer of a first polarity type between the first and second first type conductors, and

(e) forming a dielectric layer over the first and second first type conductors, the first and second electrodes, and the conductor layer of the first polarity type;

forming and stacking a successive conductive stack by repeating steps (a)-(e) over a preceding conductive stack formed by steps (a)-(e) to form the vertical structure on the ILD layer;

etching an opening through a middle portion of the plurality of conductive stacks which form the vertical structure and the ILD layer after forming the plurality of conductive stacks; and

filling the opening with a conductor layer.

2. The method of claim 1 wherein providing the first and second memory elements comprises:

forming a first section of a memory layer in contact with the first first type conductor as the first memory element and a second section of the memory layer in contact with the second first type conductor as the second memory element; and wherein

the conductor layer that fills the opening is of a second polarity type.

3. The method of claim 1 further comprising:

depositing a conductive layer of a second polarity type which lines top surface of the top most dielectric layer and sidewalls of the opening; and wherein filling the opening with a conductor layer comprises

forming a second type conductor by filling the remaining opening with a metal.

4. The method of claim 3 , wherein:

the first polarity type is n-type and the second polarity type is p-type; and

the first type conductor comprises a word line and the second type conductor comprises a bit line.

5. The method of claim 1 , wherein the first and second memory elements comprise resistive random-access memory (ReRAM).

6. The method of claim 1 wherein providing the first memory element adjacent the first first type conductor and the second memory element adjacent the second first type conductor comprises:

forming a first section of a memory layer in contact with the first first type conductor as the first memory element and a second section of the memory layer in contact with the second first type conductor as the second memory element; and further comprising

forming a select line stack on the vertical structure or between the vertical structure and the ILD layer by

forming first and second select lines on first and second sides of the vertical structure, respectively, and

forming a conductor layer of a second polarity type between the first and second select lines;

etching an opening through a middle portion of the select line stack, wherein etching the opening through the middle portion of the select line stack is performed simultaneously with etching the opening though the middle portion of the plurality of conductive stacks which form the vertical structure;

depositing a conductive layer of a second polarity type which lines top surface of a dielectric layer over the select line stack and sidewalls of the opening; and wherein filling the opening with a conductor layer comprises

filling the remaining opening with first polarity type conductor layer.

7. The method of claim 1 wherein providing the first and second memory elements comprises:

forming a first section of a memory layer in contact with the first first type conductor as the first memory element and a second section of the memory layer in contact with the second first type conductor as the second memory element.

8. The method of claim 7 wherein forming a conductive stack of the plurality of conductive stacks further comprises:

forming a first trench on a first side and a second trench on a second side of the ILD layer prior to forming the first and second first type conductors, wherein the first first type conductor is formed in the first trench and the second first type conductor is formed in the second trench; and

removing a central portion of the ILD layer to form an opening in between the first type conductors.

9. The method of claim 8 wherein forming the first and second electrodes comprises:

providing an electrode layer over top surfaces of the first and second first type conductors and the first and second memory elements and lines the opening in between the first type conductors; and

performing an etch to remove horizontal portions of the electrode layer from the top surfaces of the first type conductors and memory elements and bottom of the opening, wherein remaining electrode layer which lines a side of the first memory element forms the first electrode and remaining electrode layer which lines a side of the second memory element forms the second electrode.

10. The method of claim 9 wherein the conductor layer of the first polarity type is formed in remaining opening in between the first type conductors.

11. The method of claim 10 wherein:

etching the opening through the middle portion of the vertical structure passes through the conductor layer of the first polarity type, wherein etching the opening defines first and second sections of the conductor layer of the first polarity type; and

the conductor layer that fills the opening is of a second polarity type.

12. The method of claim 11 wherein:

the first section of the conductor layer of the first polarity type and the conductor layer of the second polarity type form a first diode as the selector of the first memory element, while the second section of the conductor layer of the first polarity type and the conductor layer of the second polarity type form a second diode as the selector of the second memory element; and

the first type conductors serve as wordlines.

13. The method of claim 7 wherein forming the conductor layer of the first polarity type is performed prior to forming the first type conductors, and wherein forming a conductive stack of the plurality of conductive stacks further comprises:

forming a hard mask layer on the conductor layer of the first polarity type; and

forming trenches on first and second sides of the conductor layer of the first polarity type and hard mask layer, wherein the first and second first type conductors are formed in the trenches.

14. The method of claim 13 wherein providing the first and second memory elements comprises:

providing the memory layer in the trenches over the ILD, top surfaces of the first and second electrodes and top surface of the hard mask layer; and

performing an etch to remove horizontal portions of the memory layer from the top surfaces of the hard mask layer and first and second electrodes, wherein the remaining memory layer which lines top surface of the ILD layer and a side of the first electrode forms the first memory element and the remaining memory layer which lines top surface of the ILD and a side of the second electrode forms the second memory element.

15. The method of claim 13 comprising:

etching the opening through the middle portion of the vertical structure passes through the hard mask layer and the conductor layer of the first polarity type, wherein etching the opening defines first and second sections of the conductor layer of the first polarity type; and

the conductor layer that fills the opening is of a second polarity type.

16. The method of claim 1 wherein forming a conductive stack of the plurality of conductive stacks further comprises:

forming a first trench on a first side and a second trench on a second side of the ILD layer prior to forming the first and second first type conductors, wherein the first first type conductor is formed in the first trench and the second first type conductor is formed in the second trench; and

removing a central portion of the ILD layer to form an opening in between the first type conductors.

17. The method of claim 16 wherein forming a conductive stack of the plurality of conductor stacks further comprises:

providing a conductor layer of a second polarity type over the first type conductors and lining the opening in between the first type conductors;

performing an etch to remove horizontal portions of the conductor layer of the second polarity type over the first type conductors and bottom of the opening, wherein the remaining conductor layer of the second polarity type forms a first section which is disposed between the first first type conductor and the conductor layer of the first polarity type and a second section which is disposed between the second first type conductor and the conductor of the first polarity type; and further comprising

etching the opening through the middle portion of the vertical structure which passes through the conductor layer of the first polarity type, wherein etching the opening defines first and second sections of the conductor layer of the first polarity type.

18. The method of claim 17 wherein forming the first and second electrodes comprises performing a silicidation process to form metal silicides on exposed surfaces of the first and second sections of the conductor layer of the first polarity type, wherein the metal silicides correspond to the first and second electrodes.

19. The method of claim 17 wherein providing the first and second memory elements comprises:

forming a first section of a memory layer in contact with a first sidewall of the opening as the first memory element and a second section of the memory layer in contact with a second sidewall of the opening as the second memory element; and wherein filling the opening with a conductor layer comprises

filling the remaining opening with a second type conductor.

20. The method of claim 19 wherein:

the first type conductors serve as bitlines;

the second type conductor serves as a wordline; and

the first section of the conductor layer of the first polarity type and a first section of the conductor layer of the second polarity type form a first diode as the selector of the first memory element, while the second section of the conductor layer of the first polarity type and the second section of the conductor layer of the second polarity type form a second diode as the selector of the second memory element.