IP Library Granted Patent US 9,335,494
Granted Patent B2
US 9,335,494 · App. 14/278,588 · Granted May 10, 2016

Optoelectronics structures

Inventors: Sandeep Razdan (Millbrae, CA); Jibin Sun (Mountain View, CA); Haipeng Zhang (Santa Clara, CA)
Assignee: Tyco Electronics Corporation
G02B6/4206G02B6/422G02B6/423G02B6/425G02B6/3652G02B6/4202G02B6/4219G02B6/4243G02B6/4245
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,335,494
App. No.
14/278,588
Granted
May 10, 2016
Kind
B2
Abstract

One aspect of the invention provides an optoelectronics structure including: a substrate defining a trench on a first surface; and a VCSEL structure mounted vertically within the trench of the substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate. Another aspect of the invention provides an optoelectronics structure including: an fiber guiding substrate defining a trench on a first surface; a VCSEL structure mounted vertically within the trench of the fiber guiding substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate; and an optical fiber mounted on the fiber guiding substrate substantially coaxial with the laser beam emitted by the VCSEL structure.

Claims (33)

1. An optoelectronics structure comprising:

a glass substrate defining a trench on a first surface; and

a VCSEL structure mounted vertically within the trench of the substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate.

2. The optoelectronics structure of claim 1 , further comprising:

an optical fiber mounted on the substrate substantially coaxial with the laser beam emitted by the VCSEL structure.

3. The optoelectronics structure of claim 2 , further comprising:

a fiber guide positioned between the optical fiber and the substrate.

4. The optoelectronics structure of claim 2 , further comprising:

a lens mounted between and substantially coaxial with a laser-emitting surface of the VCSEL structure and the optical fiber.

5. The optoelectronics structure of claim 1 , further comprising:

a waveguide or lens mounted on a laser-emitting surface of the VCSEL structure.

6. The optoelectronics structure of claim 1 , further comprising:

an electrical connection from the VCSEL structure to a second, opposite surface of the substrate.

7. An optoelectronics structure comprising:

a glass substrate defining a trench on a first surface; and

a PIN diode structure mounted vertically within the trench of the substrate such that the PIN diode structure receives a light beam substantially parallel to the substrate.

8. The optoelectronics structure of claim 7 , further comprising:

an optical fiber mounted on the substrate substantially coaxial with the PIN diode structure.

9. The optoelectronics structure of claim 8 , further comprising:

a fiber guide positioned between the optical fiber and the substrate.

10. The optoelectronics structure of claim 8 , further comprising:

a lens mounted between and substantially coaxial with the PIN diode structure and the optical fiber.

11. The optoelectronics structure of claim 8 , further comprising: a waveguide or lens mounted on the optical fiber.

12. The optoelectronics structure of claim 7 , further comprising:

an electrical connection from the PIN diode structure to a second, opposite surface of the substrate.

13. The optoelectronics structure of claim 12 , further comprising:

a driver mounted on the second, opposite surface of the substrate and electrically connected to the PIN diode structure through the electrical connection.

14. The optoelectronics structure of claim 12 , further comprising:

a transimpedance amplifier (TIA) mounted on the second, opposite surface of the substrate and electrically connected to the PIN diode structure through the electrical connection.

15. The optoelectronics structure of claim 6 , further comprising:

a driver mounted on the second, opposite surface of the substrate and electrically connected to the VCSEL structure through the electrical connection.

16. The optoelectronics structure of claim 6 , further comprising:

a transimpedance amplifier (TIA) mounted on the second, opposite surface of the substrate and electrically connected to the VCSEL structure through the electrical connection.

Assignments (2)
CHANGE OF NAME Recorded Jan 12, 2017
From: TYCO ELECTRONICS CORPORATION
To: TE CONNECTIVITY CORPORATION
Reel/Frame 041350/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2014
From: RAZDAN, SANDEEP; SUN, JIBIN; ZHANG, HAIPENG
To: TYCO ELECTRONICS CORPORATION
Reel/Frame 033408/0876 →
Continuity (1)
Related Publication 20150331204A1 · Nov 19, 2015