Vapor deposition device
A vapor deposition device has a plurality of moving plates between the cooling plate and moving vapor deposition source is controlled by the blowout panel. Moreover, when the vapor deposition materials absorbed by the blowout panel are up to the predetermined value, the moving plates are rotated around their axis simultaneously by the linkage to form a new blowout panel for performing the subsequent vapor deposition process. Consequently, the adsorption ability of the blowout board is greatly improved, and the crack and peeling off of the blowout panel caused by absorbing too many vapor deposition materials are avoided. Hence, the volume production of the evaporative coating equipment is improved.
1. A vapor deposition device having a moving vapor deposition source for coating on a substrate, the vapor deposition device comprising:
the moving vapor deposition source is movable in a first direction;
a cooling plate adapted to be securely installed over the moving vapor deposition source;
the substrate placed at an opening of the cooling plate; and
a plurality of moving plates arranged in the first direction rotatably installed between the cooling plate and the vapor deposition source by a fixing device except in front of the opening of the cooling plate;
wherein, the moving plates rotate around the fixing device simultaneously, which forms blowout panels.
2. The device as claimed in claim 1 , wherein each surface of the moving plates is treated by Sand Blasting Treatment or Molten Aluminum Splash Treatment.
3. The device as claimed in claim 1 , wherein each of the moving plates rotates around a geometric centerline of its own.
4. The device as claimed in claim 1 , wherein the moving plates are evenly distributed on the cooling plate.
5. The device as claimed in claim 4 , wherein each of the moving plates are I-shaped and has a size the same as the others; the I-shaped moving plate comprises a standing board and two protrude structures located on two ends of the standing board respectively; the protrude structures located in two adjacent moving plates are arranged in staggered formation, and the distance of the two adjacent moving plates is larger than a predetermined value; wherein the predetermined value depends on condensation parameters of the vapor deposition materials.
6. The device as claimed in claim 4 , wherein each of the moving plates is cuboid and has a uniform size the same as others; a surface of the cuboid is perpendicular to a lower surface of the cooling plate; a distance between two adjacent moving plates is larger than a first predetermined value; a long side of the surface of each of the moving plates is parallel to a low surface of each of the cooling plates; wherein, the first predetermined value depends on condensation parameters of vapor deposition materials and the size of the cuboid.
7. The device as claimed in claim 4 , wherein each of the moving plates is cuboid and has a uniform size the same as others; a surface of the cuboid is perpendicular to a lower surface of the cooling plate; a distance between two adjacent moving plates is larger than a second predetermined value; a sidewall of each of the moving plates is parallel to a low surface of each of the cooling plates; wherein, the second predetermined value depends on condensation parameters of vapor deposition materials and the size of the cuboid.
8. The device as claimed in claim 4 , wherein each of the moving plates is tetrahedron and has a uniform size the same as others; a surface of the tetrahedron is perpendicular to a lower surface of the cooling plate; a distance between two adjacent moving plates is larger than a third predetermined value, a sidewall of each of the moving plates is parallel to a low surface of each of the cooling plates; wherein, the third predetermined value depends on condensation parameters of vapor deposition materials and the size of the tetrahedron.