Carrier-free adhesive film
A method of installing flooring with an adhesive system that comprises a layer of adhesive without any adhesive carrier layer or screen or the like, covered on a first release surface and covered on the opposite side by a second release surface.
1. A method of installing flooring on a sub-floor flooring substrate at a flooring installation site, comprising:
providing an adhesive system including an adhesive layer consisting essentially of curable one component adhesive and having no carrier layer support structure therein, one side of the adhesive layer being disposed on a low surface energy release surface and the other side of the adhesive layer disposed on a relatively higher surface energy release surface at the flooring installation site;
separating the adhesive layer from the lower surface energy release surface and adhering the resulting exposed side of the adhesive layer onto a sub-floor flooring substrate;
separating the higher surface energy release surface from the adhesive layer to expose the adhesive layer on the sub-floor flooring substrate; and
before the adhesive layer cures adhering flooring material on the layer of adhesive that is adhered to the sub-floor flooring substrate and allowing the adhesive layer to cure whereby the flooring material becomes adhered to the sub-floor flooring substrate by the cured adhesive layer.
2. The method of claim 1 , wherein the lower and higher surface energy surfaces are on opposite sides of a same release liner, which is formed into a roll, with the lower surface energy side of the release liner on the outside of the roll.
3. The method of claim 1 , wherein the adhesive layer has a thickness of from about 0.4 mils to about 10 mils and the flooring comprises wood or tile.
4. The method of claim 3 , wherein the adhesive is formed from bio-based or renewable materials.
5. The method of claim 3 , wherein the adhesive is formulated to have substantially no VOC emissions.
6. The method of claim 1 , wherein the adhesive layer comprises an oil component, a hydrocarbon resin and latex polymer material.
7. The method of claim 1 , wherein the adhesive comprises non-ionic ethoxylated surfactants.
8. The method of claim 1 , wherein the adhesive layer includes about 4-10 wt. % C-5 hydrocarbon resin, about 4-10 wt. % C-9 hydrocarbon resin, and about 30 wt. % to 60 wt. % latex polymer.
9. The method of claim 8 , wherein the adhesive layer comprises about 0.50% to 2% of 1 to 40 mole ethoxylates of a nonylphenol surfactant.
10. The method of claim 8 , wherein the sub-floor flooring substrate comprises wood or concrete and the flooring comprises wood or tile.
11. The method of claim 1 , wherein the adhesive layer contains surfactants which permit the adhesive material of the adhesive layer to substantially wet selected areas of the release surface.
12. The method of claim 11 , wherein the surfactants comprise non-ionic ethylene oxide based molecules.
13. The method of claim 1 , wherein each of the lower and higher energy release surfaces comprises silicone based release agents.
14. The method of claim 1 , wherein the adhesive layer comprises an anti-foaming agent.
15. The method of claim 1 , wherein the lower energy release surface is on a first release liner and the higher energy release surface is on a second release liner.
16. The method of claim 1 , wherein the adhesive is formed from bio-based or renewable materials.
17. The method of claim 1 , wherein the adhesive is formulated to have substantially no VOC emissions.
18. The method of claim 1 , wherein the higher release energy surface layer has at least a 180° peel (g/in) at 1,200 in/min of 15 to 45.
19. The method of claim 1 , wherein the adhesive layer has a thickness between about 3 mils and about 4 mils.
20. The method of claim 1 , wherein the adhesive layer is in the form of an arrangement of stripes.
21. The method of claim 1 , wherein the adhesive contains a resin formed with hydrocarbons having 4 to 6 carbon atoms.
22. The method of claim 21 , further comprising resins formed with hydrocarbons having, on average, 8 to 10 carbon atoms.
23. The method of claim 22 , further comprising a drying oil.
24. The method of claim 1 , wherein the sub-floor flooring substrate comprises wood or concrete.
25. The method of claim 24 , wherein the flooring comprises wood or tile.