Transmission module, shielding method, transmission cable, and connector
A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.
1. A transmission module, comprising:
a connector component including
a connector side substrate having a terminal component including a ground terminal and a data terminal, and
a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and
a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed,
wherein the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded,
wherein the connector side substrate and the cable side substrate are configured as an integrated substrate made of a same material,
wherein a connector side ground layer electrically connected to the ground terminal is formed on the connector side substrate, and
wherein the connector side ground layer is disposed at least at lower and upper sides of an area where electromagnetic noises are generated due to the high frequency signal as a part including the connector side ground layer of the connector side substrate is folded.
2. The transmission module according to claim 1 , wherein
the cable side ground layer is disposed at lower, upper and lateral sides of the signal line.
3. The transmission module according to claim 1 , wherein
the cable side ground layer has a shape including a plurality of cutouts.
4. The transmission module according to claim 1 , wherein
the signal processing component is an RF chip, and
the connector side ground layer is disposed at least at lower and upper sides of the RF chip as a part including the connector side ground layer of the connector side substrate is folded.
5. The transmission module according to claim 1 , wherein
a carrier wave of a signal transmitted via the transmission cable is a millimeter wave.
6. The transmission module according to claim 1 , wherein
the cable side substrate or the connector side substrate is configured of LCP.
7. A method of shielding a signal line in the transmission module including a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and the signal line to which the high frequency signal is transmitted are formed, comprising:
folding a part including the cable side ground layer of the cable side substrate, and
disposing the cable side ground layer at least at lower and upper sides of the signal line,
wherein the connector side substrate and the cable side substrate are configured as an integrated substrate made of a same material,
wherein a connector side ground layer electrically connected to the ground terminal is formed on the connector side substrate, and
wherein the connector side ground layer is disposed at least at lower and upper sides of an area where electromagnetic noises are generated due to the high frequency signal as a part including the connector side ground layer of the connector side substrate is folded.
8. A transmission cable connected to a connector, comprising a cable side substrate having a flexibility on which a cable side ground layer and a signal line are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded,
wherein the connector includes
a substrate having a flexibility on which a terminal component including a ground terminal and a data terminal, and a ground layer electrically connected to the ground terminal are formed; and
a signal processing component mounted on the substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal,
wherein the ground layer is disposed at least at lower and upper sides of an area where electromagnetic noises are generated due to the high frequency signal as a part including the ground layer of the substrate is folded.
9. A connector, comprising:
a substrate having a flexibility on which a terminal component including a ground terminal and a data terminal, and a ground layer electrically connected to the ground terminal are formed; and
a signal processing component mounted on the substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal,
the ground layer being disposed at least at lower and upper sides of an area where electromagnetic noises are generated due to the high frequency signal as a part including the ground layer of the substrate is folded.
10. The connector according to claim 9 , wherein
the signal processing component includes an RF chip.
11. The connector according to claim 10 , wherein
the ground layer is disposed at least at lower and upper sides of the RF chip as a part including the connector side ground layer of the connector side substrate is folded.
12. The connector according to claim 9 , wherein the substrate includes LCP.
13. The transmission cable according to claim 8 , wherein the cable side ground layer has a shape including a plurality of cutouts.
14. The transmission cable according to claim 8 , the cable side substrate includes LCP.
15. The transmission cable according to claim 8 , the cable side substrate and the substrate of the connector are configured as an integrated substrate made of a same material.