Electricoacoustic component with structured conductor and dielectric layer
An electroacoustic component includes a substrate configured to carry acoustic waves. The electroacoustic component can be a guided bulk acoustic wave (GBAW) device, for example. A structured electric conductive layer is arranged on the substrate and an electrically dielectric layer (for example, aluminum oxide) is also arranged over the substrate.
1. An electroacoustic component comprising:
a substrate configured to carry acoustic waves;
a structured electrically conductive layer arranged directly on the substrate;
a SiO 2 layer arranged directly on the structured electrically conductive layer;
a dielectric layer arranged directly on the SiO 2 layer, wherein:
the dielectric layer has at least one first region comprising Al 2 O 3 and one or more second regions each comprising a metal; and
the one or more second regions extend through the dielectric layer and a portion of the SiO 2 layer; and
an insulating covering layer arranged directly on the dielectric layer and the SiO 2 layer, wherein the insulating covering layer comprises a material different from Al 2 O 3 .
2. The electroacoustic component according to claim 1 , wherein the electroacoustic component operates with guided bulk acoustic waves.
3. The electroacoustic component according to claim 1 , wherein the substrate is configured to carry a guided bulk acoustic wave having a wavelength, and wherein the first region of the dielectric layer is thicker than half the wavelength of the bulk acoustic wave.
4. The electroacoustic component according to claim 1 , wherein the structured electrically conductive layer comprises Cu, Ag, Au, Pt, or Ti.
5. The electroacoustic component according to claim 1 , wherein the substrate comprises LiNbO 3 or LiTaO 3 .
6. The electroacoustic component according to claim 1 , wherein the dielectric layer has a thickness of 1 μm to 30 μm.
7. An electroacoustic component comprising:
a substrate comprising LiNbO 3 or LiTaO 3 ;
an electrically conductive layer arranged directly on the substrate, wherein the electrically conductive layer is structured to form an electroacoustic transducer;
a SiO 2 layer arranged directly on the electrically conductive layer and the substrate;
a dielectric layer arranged directly on the SiO 2 layer, wherein:
the dielectric layer comprises a plurality of first regions each comprising aluminum oxide, and a plurality of second regions each comprising a metal;
the plurality of second regions extend through the dielectric layer and a portion of the SiO 2 layer; and
the substrate, the electrically conductive layer and the dielectric layer each comprise a part of a guided bulk acoustic wave device;
an electrically conductive Al layer arranged directly on the dielectric layer, wherein the electrically conductive Al layer is connected to the electrically conductive layer via the plurality of second regions of the dielectric layer; and
an insulating covering layer arranged directly on the dielectric layer, the SiO 2 layer and the electrically conductive Al layer, wherein the insulating covering layer comprises a material different from aluminum oxide.
8. The electroacoustic component according to claim 7 , wherein the SiO 2 layer is thicker than half a wavelength of a bulk acoustic wave of the guided bulk acoustic wave device.
9. The electroacoustic component according to claim 7 , wherein the electrically conductive layer further comprises Cu, Ag, Au, Pt, or Ti.
10. The electroacoustic component according to claim 7 , wherein the dielectric layer has a layer thickness of 1 μm to 30 μm.
11. An electroacoustic component comprising:
a substrate configured to carry acoustic waves;
a structured electrically conductive layer arranged directly on the substrate;
a SiO 2 layer arranged directly on the structured electrically conductive layer;
a dielectric layer arranged directly on the SiO 2 layer, wherein:
the dielectric layer has a first region comprising Al 2 O 3 and a plurality of second regions comprising a metal; and
the plurality of second regions extend through the dielectric layer and a portion of the SiO 2 layer;
electrical contacts connecting the structured electrically conductive layer through the SiO 2 layer and the plurality of second regions of the dielectric layer to a contact outside of the electroacoustic component; and
an insulating covering layer arranged directly on the dielectric layer, wherein the insulating covering layer comprises a material different from Al 2 O 3 .
12. The electroacoustic component according to claim 11 , wherein the substrate is configured to carry a guided bulk acoustic wave having a wavelength, and wherein the dielectric layer is thicker than half the wavelength of the bulk acoustic wave.
13. The electroacoustic component according to claim 11 , wherein the structured electrically conductive layer comprises Cu, Ag, Au, Pt, or Ti.
14. The electroacoustic component according to claim 11 , wherein the dielectric layer has a thickness of 1 μm to 30 μm.
15. The electroacoustic component according to claim 11 , wherein the substrate comprises LiNbO 3 or LiTaO 3 .