Sensor package with exposed sensor array and method of making same
A packaged sensor assembly and method of forming that includes a first substrate having opposing first and second surfaces and a plurality of conductive elements each extending between the first and second surfaces. A second substrate comprises opposing front and back surfaces, one or more detectors formed on or in the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors. A third substrate is mounted to the front surface to define a cavity between the third substrate and the front surface, wherein the third substrate includes a first opening extending from the cavity through the third substrate. The back surface is mounted to the first surface. A plurality of wires each extend between and electrically connecting one of the contact pads and one of the conductive elements.
1. A packaged sensor assembly, comprising:
a first substrate that comprises opposing front and back surfaces;
one or more detectors formed on or in the front surface;
a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors;
a second substrate mounted to the front surface to define a cavity between the second substrate and the front surface, wherein the second substrate includes a first opening extending from the cavity through the second substrate;
a trench formed into the front surface of the first substrate extending toward but not reaching the back surface; and
a plurality of conductive traces each extending from one of the contact pads and into the trench;
an insulation material covering upper surfaces of the plurality of conductive traces except for contact portions of the upper surfaces of the conductive traces in the trench;
a third substrate having one or more circuit layers and a plurality of contact pads electrically coupled to the one or more circuit layers;
electrical connectors each electrically connecting one of the contact portions of one of the conductive traces and one of the contact pads of the third substrate.
2. The packaged sensor assembly of claim 1 , wherein the second substrate is mounted to the front surface by spacer material that is disposed between the second substrate and the front surface.
3. The packaged sensor assembly of claim 1 , wherein the one or more detectors include a plurality of photo detectors.
4. The packaged sensor assembly of claim 3 , wherein the first opening is disposed over the plurality of photo detectors.
5. The packaged sensor assembly of claim 1 , wherein the one or more detectors includes one or more chemical sensors.
6. The packaged sensor assembly of claim 5 , further comprising:
a second opening extending from the cavity through the second substrate.
7. The packaged sensor assembly of claim 6 , further comprising:
one or more dam structures in the cavity that define a non-linear flow path between the first opening and the second opening.
8. The packaged sensor assembly of claim 1 , further comprising:
overmold material encapsulating at least portions of the front surface, the electrical connectors, and the third substrate.
9. The packaged sensor assembly of claim 8 , further comprising:
a lens module mounted to the overmold material, wherein the lens module comprising a housing and one or more lenses positioned to focus light through the first opening and onto the one or more detectors.
10. A method of forming a packaged sensor assembly, comprising:
providing a first substrate that comprises:
opposing front and back surfaces,
one or more detectors formed on or in the front surface, and
a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors;
mounting a second substrate to the front surface to define a cavity between the second substrate and the front surface, wherein the second substrate includes a first opening extending from the cavity through the second substrate;
forming a trench into the front surface of the first substrate extending toward but not reaching the back surface; and
forming a plurality of conductive traces each extending from one of the contact pads and into the trench;
an insulation material covering upper surfaces of the plurality of conductive traces except for contact portions of the upper surfaces of the conductive traces in the trench;
providing a third substrate having one or more circuit layers and a plurality of contact pads electrically coupled to the one or more circuit layers; and
forming electrical connectors each electrically connecting one of the contact portions of one of the conductive traces and one of the contact pads of the third substrate.
11. The method of claim 10 , wherein the second substrate is mounted to the front surface by spacer material that is disposed between the second substrate and the front surface.
12. The method of claim 10 , wherein the one or more detectors include a plurality of photo detectors.
13. The method of claim 12 , wherein the first opening is disposed over the plurality of photo detectors.
14. The method of claim 10 , wherein the one or more detectors includes one or more chemical sensors.
15. The method of claim 14 , further comprising:
forming a second opening extending from the cavity through the second substrate.
16. The method of claim 15 , further comprising:
forming one or more dam structures in the cavity that define a non-linear flow path between the first opening and the second opening.
17. The method of claim 10 , further comprising:
encapsulating at least portions of the front surface, the electrical connectors, and the third substrate in overmold material.
18. The method of claim 17 , further comprising:
mounting a lens module to the overmold material, wherein the lens module comprising a housing and one or more lenses positioned to focus light through the first opening and onto the one or more detectors.