Interposer having optical interface with alignment structures formed by a resist layer of interposer and related optic assemblies
Disclosed are interposers and interposer structures having an optical interface for optical fiber connection with a related fiber optic ferrule that can form a portion of an optical assembly. The interposer is useful for transmitting optical signals to/from the interposer for high-speed communication. Specifically, the interposer provides a passively aligned structure with an optical alignment structure of the interposer formed by a resist layer of the interposer.
1. An interposer having a connector mounting surface, an optical alignment structure and an optical interface, the optical alignment structure being formed by a resist layer of the interposer.
2. The interposer of claim 1 , wherein the optical alignment structure includes one or more optical fiber alignment features for aligning one or more optical fibers to the optical interface.
3. The interposer of claim 1 , the connector mounting surface being recessed from a planar surface of the interposer.
4. The interposer of claim 3 , wherein the connector mounting surface has a U-shape.
5. The interposer of claim 1 , wherein the optical alignment structure is disposed on the planar surface of the interposer.
6. The interposer of claim 1 , the interposer being at least partially formed from silicon.
7. The interposer of claim 1 , the interposer having an optical assembly attached to the connector mounting surface.
8. The interposer of claim 1 , wherein the interposer is formed from a material with a first coefficient of thermal expansion (CTE) and a ferrule of the optical assembly is formed from a material with a second CTE, and the CTE delta between the interposer and the ferrule is 4.0×10−6° C. (Δmm/mm) or less at ambient conditions.
9. A method of making an interposer, comprising:
forming an interposer on a silicon material so it has a connector mounting surface with an optical interface; and
forming an optical alignment feature in the interposer that is disposed adjacent to the connector mounting surface; wherein the optical alignment feature is formed in a resist layer of the interposer.
10. The method of claim 9 , wherein the connector mounting surface is formed as recessed portion from a planar surface of the interposer.
11. The method of claim 9 , wherein the optical alignment feature has one or more optical fiber alignment features.
12. The method of claim 11 , wherein the one or more optical fiber alignment features is a fiber rake.
13. An interposer having a connector mounting surface, an optical alignment structure and an optical interface, the optical alignment structure being formed by a resist layer of the interposer, and the connector mounting surface being recessed from a planar surface of the interposer.
14. The interposer of claim 13 , wherein the optical alignment structure includes one or more optical fiber alignment features for aligning one or more optical fibers to the optical interface.
15. The interposer of claim 13 , wherein the optical alignment structure is disposed on the planar surface of the interposer.
16. The interposer of claim 13 , the interposer being at least partially formed from silicon.
17. The interposer of claim 13 , the interposer having an optical assembly attached to the connector mounting surface.
18. The interposer of claim 13 , wherein the interposer is formed from a material with a first coefficient of thermal expansion (CTE) and a ferrule of the optical assembly is formed from a material with a second CTE, and the CTE delta between the interposer and the ferrule is 4.0×10−6° C. (Δmm/mm) or less at ambient conditions.