Heat-dissipating light-emitting device and method for its assembly

1. A heat-dissipating light-emitting device, the device comprising:

a light-emitting element having a light-emitting surface and a non-light-emitting surface;

a thermally conducting base plate having a first surface against which the light-emitting element is placed, a second surface, and a perimeter surface, the thermally conducting base plate electrically isolated from the light-emitting element, the thermally conducting base plate in physical contact with a heat sink, the heat sink further comprising a housing having an open end, such that the light-emitting device fits snugly in the housing with the light-emitting surface facing the open end; and

a driver circuit element having a base surface in contact with the second surface of the base plate, and an opposite surface, the driver circuit element electrically coupled to the light-emitting element, the driver circuit electrically isolated from the base plate.

2. A device according to claim 1 , wherein the base plate further comprises at least one wing that contacts the heat sink.

3. A device according to claim 1 , wherein the base plate further comprises a cavity in the first surface shaped to admit the non-light-emitting surface of light-emitting element.

4. A device according to claim 1 , wherein the base plate further comprises a cavity in the second surface shaped to admit the base surface of the driver circuit element.

5. A light-emitting device according to claim 1 , wherein the heat sink further comprises at least one heat-dissipating fin.

6. A device according to claim 1 , wherein the driver circuit element further comprises at least one rectifier.

7. A heat-dissipating light-emitting device, the device comprising:

a light-emitting element having a light-emitting surface and a non-light-emitting surface;

a thermally conducting base plate having a first surface against which the light-emitting element is placed, a second surface, and a perimeter surface, the thermally conducting base plate electrically isolated from the light-emitting element, the thermally conducting base plate in physical contact with a heat sink; and

a driver circuit element having a base surface in contact with the second surface of the base plate, and an opposite surface, the driver circuit element electrically coupled to the light-emitting element by a plurality of conducting clips that connect contact points in the light-emitting element to contact points in the driving circuit, the driver circuit electrically isolated from the base plate.

8. A device according to claim 7 , wherein the conducting clips are shaped to pass from the first surface of the base plate to the second surface of the base plate without touching the base plate.

9. A device according to claim 7 , further comprising an electrically insulating holder having:

a first member that extends over a portion of the light-emitting surface of the light-emitting element;

a second member that extends over a portion of the opposite surface of the driver circuit element; and

a third member that connects the first member to the second member across the peripheral surface of the base plate.

10. A device according to claim 9 , wherein the holder further comprises a plurality of grooves, each groove containing one of the plurality of conducting clips, each groove running from a first end at an electrical contact on the light-emitting surface of the light-emitting element, across the first member of the holder, across the third member of the holder, across the second member of the holder, and to a second end at an electrical contact on the opposite surface of the driver circuit element.

11. A device according to claim 9 , wherein the holder further comprises a plurality of detachable sections.

12. A device according to claim 9 , wherein the holder further comprises at least one slot in the third portion of the holder, and wherein the base plate further comprises at least one wing that extends through the at least one slot and beyond the third portion of the holder.

13. A device according to claim 12 , wherein the heat sink further comprises a housing having an interior surface, the housing further comprising at least one shelf on the interior surface, such that the at least one wing that extends through the at least one slot rests on the at least one shelf.

14. A device according to claim 9 , wherein the portion of the light-emitting surface covered by the first portion does not emit light.

15. A device according to claim 1 , wherein the device is attached to a light fixture adapted for insertion into a recess.

16. A method for assembling a heat-dissipating, light-emitting device, the device comprising a light-emitting element having a light-emitting surface and a non-light-emitting surface, a thermally conducting base plate having a first surface against which the light-emitting element is placed, a second surface, and a perimeter surface, the thermally conducting base plate electrically isolated from the light-emitting element, the thermally conducting base plate in physical contact with a heat sink, and a driver circuit element having a base surface in contact with the second surface of the base plate, and an opposite surface, the driver circuit element electrically coupled to the light-emitting element, the driver circuit electrically isolated from the base plate, the method comprising:

providing a light-emitting element having a light-emitting surface and a non-light-emitting surface, a heat-conducting base plate having a first surface, a second surface, and a perimeter surface, and a driver circuit element having a base surface and an opposite surface, and a heat sink;

placing the non-light-emitting side of the light-emitting element in physical contact with the first side of the base plate so that the light emitting element is electrically isolated from the base plate;

placing the base side of the driver circuit element in contact with the second side of the base plate so that the driver circuit element is electrically isolated from the base plate;

electrically coupling the light-emitting element to the driver circuit elements while keeping the light-emitting element and the driver circuit element electrically isolated from the base plate; and

placing the thermally conducting base plate in contact with the heat sink.