Semiconductor device and method for manufacturing the same
It is an object to provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a semiconductor device including an inverted staggered thin film transistor whose semiconductor layer is an oxide semiconductor layer, a buffer layer is provided over the oxide semiconductor layer. The buffer layer is in contact with a channel formation region of the semiconductor layer and source and drain electrode layers. A film of the buffer layer has resistance distribution. A region provided over the channel formation region of the semiconductor layer has lower electrical conductivity than the channel formation region of the semiconductor layer, and a region in contact with the source and drain electrode layers has higher electrical conductivity than the channel formation region of the semiconductor layer.
1. A semiconductor device comprising:
a first oxide semiconductor layer including a channel formation region;
a second oxide semiconductor layer in contact with the first oxide semiconductor layer;
a gate electrode overlapping with the channel formation region;
a gate insulating layer between the gate electrode and the first oxide semiconductor layer;
a source electrode in contact with a first region of the first oxide semiconductor layer;
a drain electrode in contact with a second region of the first oxide semiconductor layer,
wherein an electrical conductivity of the first region is higher than an electrical conductivity of the channel formation region, and
wherein an electrical conductivity of the second region is higher than an electrical conductivity of the channel formation region.
2. The semiconductor device according to claim 1 , wherein the source and drain electrodes each comprises at least one of titanium, aluminum, manganese, magnesium, zirconium, beryllium, thorium, and copper.
3. The semiconductor device according to claim 1 , wherein the source and drain electrodes each comprises a metal oxide in contact with the first oxide semiconductor layer.
4. The semiconductor device according to claim 1 ,
wherein the source and drain electrodes each comprises a metal, and
wherein a normal electrode potential of the metal is smaller than a normal electrode potential of zinc.
5. The semiconductor device according to claim 1 , wherein a side surface of the source electrode and a side surface of the drain electrode are in contact with the first oxide semiconductor layer.
6. The semiconductor device according to claim 1 , wherein each of the first oxide semiconductor layer and the second oxide semiconductor layer comprises indium, gallium, and zinc.
7. A display module comprising the semiconductor device according to claim 1 , wherein the display module comprises an FPC.
8. An electronic apparatus comprising the semiconductor device according to claim 1 , wherein the electronic apparatus comprises at least one of a speaker, a battery, and an operation key.
9. A semiconductor device comprising:
a first oxide semiconductor layer including a channel formation region;
a second oxide semiconductor layer in contact with the first oxide semiconductor layer;
a gate electrode overlapping with the channel formation region;
a gate insulating layer between the gate electrode and the first oxide semiconductor layer;
a source electrode in contact with a first region of the first oxide semiconductor layer;
a drain electrode in contact with a second region of the first oxide semiconductor layer,
wherein an electrical conductivity of the first region is higher than an electrical conductivity of the channel formation region,
wherein an electrical conductivity of the second region is higher than an electrical conductivity of the channel formation region,
wherein a concentration of oxygen contained in the first region is lower than a concentration of oxygen contained in the channel formation region, and
wherein a concentration of oxygen contained in the second region is lower than a concentration of oxygen contained in the channel formation region.
10. The semiconductor device according to claim 9 , wherein the source and drain electrodes each comprises at least one of titanium, aluminum, manganese, magnesium, zirconium, beryllium, thorium, and copper.
11. The semiconductor device according to claim 9 , wherein the source and drain electrodes each comprises a metal oxide in contact with the first oxide semiconductor layer.
12. The semiconductor device according to claim 9 ,
wherein the source and drain electrodes each comprises a metal, and
wherein a normal electrode potential of the metal is smaller than a normal electrode potential of zinc.
13. The semiconductor device according to claim 9 , wherein a side surface of the source electrode and a side surface of the drain electrode are in contact with the first oxide semiconductor layer.
14. The semiconductor device according to claim 9 , wherein each of the first oxide semiconductor layer and the second oxide semiconductor layer comprises indium, gallium, and zinc.
15. A display module comprising the semiconductor device according to claim 9 , wherein the display module comprises an FPC.
16. An electronic apparatus comprising the semiconductor device according to claim 9 , wherein the electronic apparatus comprises at least one of a speaker, a battery, and an operation key.