Plasma erosion resistant rare-earth oxide based thin film coatings

1. An article comprising:

a body; and

a first protective layer on at least one surface of the body, wherein the first protective layer is a thin film coating having a thickness of less than approximately 20 microns that comprises a first ceramic selected from a group consisting of:

Y 3 Al 5 O 12 having a volume resistivity of 11.3E16 Ω·cm+/−up to 10%, a dielectric constant of 9.76+/−up to 10%, a thermal conductivity of 20.1 W/m·K+/−up to 10%, a hermiticity of 4.4E-10 cm 3 /s+/−up to 10%, and a hardness of 8.5 GPa+/−up to 10%;

Er 3 Al 5 O 12 having a dielectric constant of 9.54+/−up to 10%, a thermal conductivity of 19.2 W/m·K+/−up to 10%, a hermiticity of 9.5E-10 cm 3 /s+/−up to 10%, and a hardness of 9 GPa+/−up to 10%;

Er 2 O 3 having a dielectric constant of 9.67+/−up to 10%, a thermal conductivity of 19.4 W/m·K+/−up to 10%, a hermiticity of 5.5E-9 cm 3 /s+/−up to 10%, and a hardness of 5 GPa+/−10%; and

a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , the ceramic compound having a volume resistivity of 4.1E16 Ω·cm+/−up to 10%, a dielectric constant of 9.83+/−up to 10%, a thermal conductivity of 19.9 W/m·K+/−up to 10%, a hermiticity of 1.2E-9 cm 3 /s+/−up to 10%, and a hardness of 7.8 GPa+/−up to 10%.

2. The article of claim 1 , further comprising:

a transition layer between the at least one surface of the body and the first protective layer, wherein the transition layer provides a diffusion bond between the first protective layer and the at least one surface of the body, wherein the body comprises Al 2 O 3 , the first protective layer is the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , and the transition layer is Y 3 Al 5 O 12 .

3. The article of claim 1 , further comprising:

a transition layer between the at least one surface of the body and the first protective layer, wherein the transition layer provides a diffusion bond between the first protective layer and the at least one surface of the body, wherein the body comprises Al 2 O 3 , the first protective layer is the Er 2 O 3 , and the transition layer is Er 3 Al 5 O 12 .

4. The article of claim 1 , wherein the first ceramic is the ceramic compound comprising Y 4 Al 2 O 9 and the solid-solution of Y 2 O 3 —ZrO 2 , and wherein the ceramic compound comprising Y 4 Al 2 O 9 and the solid-solution of Y 2 O 3 —ZrO 2 further has an amorphous structure and an erosion rate of less than 5 nm/hr+/−up to 10% when exposed to a CH 4 /Cl 2 plasma chemistry.

5. The article of claim 1 , further comprising:

a protective layer stack on the at least one surface of the body, the protective layer stack comprising at least the first protective layer and a second protective layer covering the first protective layer, wherein the second protective layer has a thickness of less than approximately 20 microns and comprises a second ceramic different from the first ceramic, the second ceramic selected from a group consisting of: Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Er 2 O 3 , Gd 2 O 3 , Er 3 Al 5 O 12 , Gd 3 Al 5 O 12 and a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

6. The article of claim 1 , further comprising:

a second protective layer on at the least one surface of the body, wherein the second protective layer is a thick film having a thickness of greater than approximately 100 microns that comprises a second ceramic selected from a group consisting of Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Y 2 O 3 , and the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , wherein the first protective layer covers the second protective layer.

7. An article comprising:

a ceramic body; and

a first protective layer on at least one surface of the ceramic body, wherein the first protective layer is a thin film coating having a thickness of less than approximately 20 microns that comprises a first ceramic selected from a group consisting of:

Y 3 Al 5 O 12 having a volume resistivity of 11.3E16 Ω·cm+/−up to 10%, a dielectric constant of 9.76+/−up to 10%, a thermal conductivity of 20.1 W/m·K+/−up to 10%, a hermiticity of 4.4E-10 cm 3 /s+/−up to 10%, and a hardness of 8.5 GPa+/−up to 10%;

Er 3 Al 5 O 12 having a dielectric constant of 9.54+/−up to 10%, a thermal conductivity of 19.2 W/m·K+/−up to 10%, a hermiticity of 9.5E-10 cm 3 /s+/−up to 10%, and a hardness of 9 GPa+/−up to 10%;

Er 2 O 3 having a dielectric constant of 9.67+/−up to 10%, a thermal conductivity of 19.4 W/m·K+/−up to 10%, a hermiticity of 5.5E-9 cm 3 /s+/−up to 10%, and a hardness of 5 GPa+/−10%; and

a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , the ceramic compound having a volume resistivity of 4.1E16 Ω·cm+/−up to 10%, a dielectric constant of 9.83+/−up to 10%, a thermal conductivity of 19.9 W/m·K+/−up to 10%, a hermiticity of 1.2E-9 cm 3 /s+/−up to 10%, and a hardness of 7.8 GPa+/−up to 10%;

wherein the first protective layer comprises a plurality of surface features formed in a surface of the first protective layer that is not facing the at least one surface of the ceramic body, wherein the plurality of surface features are not in the at least one surface of the ceramic body, and wherein the thickness of the first protective layer at first locations that include the surface features is greater than the thickness of the first protective layer at second locations that do not include the surface features.

8. The article of claim 7 , wherein:

the article comprises a chamber component selected from a group consisting of a chamber lid, a nozzle, a showerhead base, a showerhead gas distribution plate (GDP), a chamber viewport, a process kit ring, a shield, a plasma screen, a flow equalizer, an electrostatic chuck, a chamber wall and a liner kit; and

the ceramic body comprises at least one of Al 2 O 3 , AlN, quartz, sapphire or SiC.

9. The article of claim 7 , further comprising:

a protective layer stack on the at least one surface of the ceramic body, the protective layer stack comprising at least the first protective layer and a second protective layer covering the first protective layer, wherein the second protective layer has a thickness of less than approximately 20 microns and comprises a second ceramic different from the first ceramic, the second ceramic selected from a group consisting of: Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Er 2 O 3 , Gd 2 O 3 , Er 3 Al 5 O 12 , Gd 3 Al 5 O 12 and a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

10. The article of claim 9 , wherein:

the second protective layer in the protective layer stack has a crystalline or nano-crystalline structure and comprises Er 2 O 3 , Gd 2 O 3 , or the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

11. The article of claim 9 , wherein the ceramic body has a first coefficient of thermal expansion value, the first protective layer has a second coefficient of thermal expansion value, and the second protective layer has a third coefficient of thermal expansion value, wherein the second coefficient of thermal expansion value is between the first coefficient of thermal expansion value and the third coefficient of thermal expansion value.

12. The article of claim 7 , further comprising:

a second protective layer on at the least one surface of the ceramic body, wherein the second protective layer is a thick film having a thickness of greater than approximately 100 microns that comprises a second ceramic selected from a group consisting of Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Y 2 O 3 , and the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , wherein the first protective layer covers the second protective layer.

13. The article of claim 7 , wherein a first roughness of the first protective layer is approximately the same as a second roughness of the ceramic body.

14. The article of claim 7 , wherein:

the Y 3 Al 5 O 12 further has an amorphous structure and an erosion rate of less than 2 nm/hr+/−up to 10% when exposed to a CH 4 /Cl 2 plasma chemistry; or

the Er 3 Al 5 O 12 further has an amorphous structure and an erosion rate of about 70 nm/hr+/−up to 10% when exposed to a H 2 /NF 3 plasma chemistry.

15. The article of claim 7 , further comprising:

a transition layer between the at least one surface of the ceramic body and the first protective layer, wherein the transition layer provides a diffusion bond between the first protective layer and the at least one surface of the ceramic body, wherein the ceramic body comprises Al 2 O 3 , the first protective layer is the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , and the transition layer is Y 3 Al 5 O 12 .

16. The article of claim 7 , further comprising:

a transition layer between the at least one surface of the ceramic body and the first protective layer, wherein the transition layer provides a diffusion bond between the first protective layer and the at least one surface of the ceramic body, wherein the ceramic body comprises Al 2 O 3 , the first protective layer is the Er 2 O 3 , and the transition layer is Er 3 Al 5 O 12 .

17. A chamber component for a processing chamber prepared by a process comprising:

performing at least one of ion assisted deposition (IAD) or physical vapor deposition (PVD) to deposit a first protective layer on at least one surface of a body, wherein the first protective layer is a thin film coating having a thickness of less than approximately 20 microns that comprises a first ceramic selected from a group consisting of:

Y 3 Al 5 O 12 having a volume resistivity of 11.3E16 Ω·cm+/−up to 10%, a dielectric constant of 9.76+/−up to 10%, a thermal conductivity of 20.1 W/m·K+/−up to 10%, a hermiticity of 4.4E-10 cm 3 /s+/−up to 10%, and a hardness of 8.5 GPa+/−up to 10%;

Er 2 O 3 having a dielectric constant of 9.67+/−up to 10%, a thermal conductivity of 19.4 W/m·K+/−up to 10%, a hermiticity of 5.5E-9 cm 3 /s+/−up to 10%, and a hardness of 5 GPa+/−10%;

Er 3 Al 5 O 12 having a dielectric constant of 9.54+/−up to 10%, a thermal conductivity of 19.2 W/m·K+/−up to 10%, a hermiticity of 9.5E-10 cm 3 /s+/−up to 10%, and a hardness of 9 GPa+/−up to 10%; and

a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , the ceramic compound having a volume resistivity of 4.1E16 Ω·cm+/−up to 10%, a dielectric constant of 9.83+/−up to 10%, a thermal conductivity of 19.9 W/m·K+/−up to 10%, a hermiticity of 1.2E-9 cm 3 /s+/−up to 10%, and a hardness of 7.8 GPa+/−up to 10%; and

performing at least one of IAD or PVD to deposit a second protective layer on the first protective layer, wherein the second protective layer has a thickness of less than approximately 20 microns and comprises a second ceramic different from the first ceramic, the second ceramic selected from a group consisting of: Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Er 2 O 3 , Gd 2 O 3 , Er 3 Al 5 O 12 , Gd 3 Al 5 O 12 and the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 ,

wherein at least one of the first protective layer or the second protective layer comprises a plurality of surface features formed in at least one of a surface of the first protective layer or a surface of the second protective layer that is not facing the at least one surface of the body, wherein the plurality of surface features are not in the at least one surface of the body, and wherein the thickness of at least one of the first protective layer or the second protective layer at first locations that include the surface features is greater than the thickness of the at least one of the first protective layer or the second protective layer at second locations that do not include the surface features.

18. The chamber component of claim 17 , further comprising:

a protective layer stack on the at least one surface of the body, the protective layer stack comprising a plurality of alternating layers of a first ceramic material and a second ceramic material, wherein the first protective layer is a first layer of the protective layer stack that comprises the first ceramic material, and wherein the second protective layer is a second layer of the protective layer stack that comprises the second ceramic material.

19. The chamber component of claim 17 , wherein:

the first protective layer and the second protective layer form a protective layer stack, and the second protective layer in the protective layer stack has a crystalline or nano-crystalline structure and comprises Er 2 O 3 or Gd 2 O 3 .

20. The chamber component of claim 17 , wherein the at least one surface of the body has a first coefficient of thermal expansion value, the first protective layer has a second coefficient of thermal expansion value, and the second protective layer has a third coefficient of thermal expansion value, wherein the second coefficient of thermal expansion value is between the first coefficient of thermal expansion value and the third coefficient of thermal expansion value.