IP Library Granted Patent US 9,933,316
Granted Patent B2
US 9,933,316 · App. 14/308,214 · Granted Apr 3, 2018

Thermal sensor

Inventors: Zhongfen Ding (South Windsor, CT); Jonathan Rheaume (West Hartford, CT); Theresa Hugener-Campbell (Coventry, CT)
Assignee: Kidde Technologies, Inc.
G01K7/16G01K3/005G01K11/06G01M99/002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,933,316
App. No.
14/308,214
Granted
Apr 3, 2018
Kind
B2
Abstract

A thermal sensor for an aircraft includes a first electrode, a second electrode, a support layer disposed between the first electrode and the second electrode, and a state changing material is configured to disposed within the support layer, wherein the state changing material transitions between a non-conductive state to a conductive state at a threshold temperature to electrically connect the first and second electrodes.

Claims (11)

1. A method for manufacturing a thermal/overheat sensor, comprising:

dip coating a support layer using a molten state changing material;

disposing a first and second aluminum plate electrodes on the support layer after dip coating, wherein dip coating includes dip coating the support layer in a molten or aqueous salt mixture; and

sealing the support layer between the first and second aluminum plate electrodes.

2. The method of claim 1 , wherein sealing the support layer includes disposing a sealant on an exposed edge of the support layer and hot pressing the sealant.

3. The method of claim 2 , further comprising hot pressing the first and second electrodes, the support layer, and the sealant together into a sandwich.

4. A method for manufacturing a thermal/overheat sensor, comprising:

dip coating a support layer using a molten state changing material;

disposing a first and second aluminum plate electrodes on the support layer after dip coating; and

sealing the support layer between the first and second aluminum plate electrodes, wherein sealing the support layer includes disposing a sealant on an exposed edge of the support layer and hot pressing the sealant.

5. The method of claim 4 , further comprising hot pressing the first and second electrodes, the support layer, and the sealant together into a sandwich.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2014
From: DING, ZHONGFEN; RHEAUME, JONATHAN; HUGENER-CAMPBELL, THERESA
To: KIDDE TECHNOLOGIES, INC.
Reel/Frame 033136/0067 →
Continuity (1)
Related Publication 20150369673A1 · Dec 24, 2015