Conductive structures, systems and devices including conductive structures and related methods
Conductive structures include a plurality of conductive steps and a contact extending at least partially therethrough in communication with at least one of the plurality of conductive steps and insulated from at least another one of the conductive steps. Devices may include such conductive structures. Systems may include a semiconductor device and a stair step conductive structure having a plurality of contacts extending through a step of the stair step conductive structure. Methods of forming conductive structures include forming contacts in contact holes formed through at least one conductive step of a conductive structure. Methods of forming electrical connections in stair step conductive structures include forming contacts in contact holes formed through each step of the stair step conductive structure.
1. A conductive structure, comprising:
a stacked volume of conductive materials extending laterally along the conductive structure, each conductive material of the volume of conductive materials being at least partially separated from an adjacent conductive material of the volume of conductive materials by insulative material, at least one conductive material of the stacked volume of conductive materials directly overlying at least one adjacent conductive material of the stacked volume of conductive materials; and
contacts comprising a first contact and additional contacts, each contact of the contacts being laterally offset from the remaining contacts of the contacts and extending through at least one respective conductive material of the volume of conductive materials, wherein each contact of the contacts is in communication with the at least one respective conductive material of the volume of conductive materials and insulated from at least another conductive material of the volume of conductive materials, and wherein each contact of the additional contacts extends through at least one additional conductive material of the volume of conductive materials than at least one adjacent contact of the contacts.
2. The conductive structure of claim 1 , wherein each contact of the contacts comprises a proximal portion having a first width and a distal portion having a second width greater than the first width, and wherein each contact of the contacts is in communication with the at least one respective conductive material at the distal portion having the second width.
3. The conductive structure of claim 1 , wherein each contact of the contacts intersects each conductive material of the volume of conductive materials underlying the respective contact.
4. The conductive structure of claim 1 , wherein the volume of conductive materials comprises conductive steps, each conductive step of the conductive steps having a lateral end portion laterally offset from a lateral end portion of an adjacent step.
5. The conductive structure of claim 4 , wherein each contact of the contacts extends through and is in communication with one lateral end portion of one conductive step of the conductive steps.
6. The conductive structure of claim 1 , wherein each contact of the contacts is in communication with a different conductive material of the volume of conductive materials.
7. The conductive structure of claim 1 , wherein each conductive material of the volume of conductive materials comprises a contact portion laterally offset from a contact portion of an adjacent conductive material of the volume of conductive materials, wherein each contact of the contacts is in communication with the at least one respective conductive material at the contact portion of the at least one respective conductive material.
8. The conductive structure of claim 1 , further comprising an interconnect in communication with each contact of the contacts, wherein the conductive structure overlies the interconnect, and wherein each contact of the contacts extends through the at least one respective conductive material to the interconnect.
9. A conductive structure, comprising:
conductive steps extending laterally along the conductive structure, each conductive step of the conductive steps being at least partially separated from an adjacent conductive step of the conductive steps by insulative material;
contacts comprising:
a first contact intersecting and extending through at least one conductive step of the conductive steps, wherein the first contact is in communication with the at least one conductive step; and
a second contact intersecting and extending through the at least one conductive step and at least another conductive step of the conductive steps, wherein the second contact is in communication with the at least another conductive step and insulated from the at least one conductive step; and
an interconnect in communication with the first contact and the second contact, wherein the conductive structure overlies the interconnect, and wherein the first contact and the second contact extend to the interconnect, each conductive step of the conductive steps overlying one or more of at least one adjacent conductive step of the conductive steps and the interconnect.
10. The conductive structure of claim 9 , wherein each of the first contact and the second contact comprises a first portion having a first width and a second portion having a second width greater than the first width, wherein the first contact is in communication with the at least one conductive step at the second portion having the second width of the first contact, and wherein the second contact is in communication with the at least another conductive step at the second portion having the second width of the second contact.
11. A device, comprising:
memory cells; and
a conductive structure comprising:
a volume of conductive materials, each conductive material of the volume of conductive materials being in electrical communication with a respective at least one memory cell of the memory cells; and
contacts each extending through at least one conductive material of the volume of conductive materials, each contact of the contacts being in electrical communication with a respective at least one conductive material of the volume of conductive materials and being insulated from another conductive material of the volume of conductive materials with insulative material disposed at least partially between the contact and the another conductive material, wherein each contact of the contacts comprises a first portion having a first width and a second portion having a second width greater than the first width, and wherein each contact of the contacts intersects and is in communication with the at least one respective conductive material at the second portion having the second width.
12. A conductive structure, comprising:
a stacked volume of conductive steps extending laterally along the conductive structure, each conductive step of the volume of conductive steps being at least partially separated from an adjacent conductive step of the volume of conductive steps by insulative material, at least one conductive step overlying an adjacent conductive step of the stacked volume of conductive steps; and
contacts comprising a first contact and additional contacts, each contact of the contacts being laterally offset from the remaining contacts of the contacts and extending through at least one respective conductive step of the volume of conductive steps, wherein each contact of the contacts is in communication with the at least one respective conductive step of the volume of conductive steps and insulated from at least another conductive step of the volume of conductive steps, and wherein each contact of the additional contacts extends through at least one additional conductive step of the volume of conductive steps than at least one adjacent contact of the contacts.
13. The conductive structure of claim 12 , wherein each conductive step of the stacked volume of conductive steps has a lateral end portion laterally offset from a lateral end portion of an adjacent conductive step of the stacked volume of conductive steps.