IP Library › Granted Patent US 9,174,453
Granted Patent B1
US 9,174,453 · App. 14/311,022 · Granted Nov 3, 2015

Microfluidic refill cartridge having a vent hole and a nozzle plate on same side

Inventors: Simon Dodd (West Linn, OR); Joe Scheffelin (Poway, CA); Dave Hunt (San Diego, CA); David Burney (Ramona, CA)
Assignee: STMicroelectronics, Inc.
B41J2/17506
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Quick Facts
Patent No.
US 9,174,453
App. No.
14/311,022
Granted
Nov 3, 2015
Kind
B1
Abstract

Embodiments disclosed herein are directed to a microfluidic refill cartridge having a vent hole and nozzles on a same side of the cartridge. In one or more embodiments, the vent hole and nozzles are located on upper surfaces of the cartridge, such as on a lid that is coupled to a reservoir. In particular, the nozzles and the vent hole may be formed on a microfluidic delivery member that is secured to the lid. A single cover may be used to cover the vent hole and the nozzles. In some embodiments, the single cover may be a flexible material and may adhere to the microfluidic delivery member.

Claims (37)

1. A lid for covering an opening of a microfluidic refill cartridge, the lid comprising:

a body portion having first and second surfaces and a first through hole extending from the first surface to the second surface;

a microfluidic delivery member located on the first surface of the body portion, the microfluidic delivery member including:

a circuit board having a second through hole that is in fluid communication with the first through hole of the body portion; and

a die coupled to the circuit board, the die including a nozzle plate having a plurality of nozzles; and

a cover covering the nozzles and the second through hole of the circuit board and sealing the nozzles and the second through hole from atmosphere.

2. The lid of claim 1 , wherein the nozzle plate is in a first plane and an upper surface of the circuit board is in a second plane that is substantially planar with the first plane.

3. The lid of claim 1 , wherein the cover includes an adhesive layer that secures the cover to the microfluidic delivery member.

4. The lid of claim 3 , wherein the cover is pressure sensitive tape.

5. The lid of claim 1 , wherein the cover is flexible.

6. The lid of claim 1 , wherein the cover includes a first inner member that is flexible and located over the microfluidic delivery member and a second outer cover that is rigid.

7. The lid of claim 6 , wherein the first inner member conforms to the microfluidic delivery member to seal the nozzles and the second through hole.

8. The lid of claim 6 , wherein the first inner member conforms to topography differences on the microfluidic delivery member.

9. The lid of claim 1 , wherein the cover is secured to a portion of the body portion.

10. The lid of claim 9 , further comprising clips and the cover is secured to the body portion by the clips.

11. The lid of claim 1 , wherein the body portion comprises a channel that places the first through hole in fluid communication with the second through hole.

12. The lid of claim 1 , wherein the cover is removable.

13. A microfluidic delivery member located on a lid of a microfluidic refill cartridge, the microfluidic delivery member comprising:

a circuit board having a first surface, a second surface opposing the first surface, and a through hole extending from the first surface to the second surface;

a die located on the first surface of the circuit board, the die including a nozzle plate having a plurality of nozzles; and

a removable cover covering the plurality of nozzles and the through hole and sealing the nozzles and the through hole from atmosphere.

14. The microfluidic delivery member of claim 13 , wherein the cover includes adhesive material that secures the cover to the first surface of the circuit board.

15. The microfluidic delivery member of claim 13 , wherein the cover is pressure sensitive tape.

16. The microfluidic delivery member of claim 13 , wherein the cover includes a flexible material.

17. The microfluidic delivery member of claim 13 , wherein the nozzle plate is in a first plane and the first surface of the circuit board is in a second plane that is different from the first plane and is substantially parallel to the first plane, and wherein the cover includes a flexible material that conforms to the first plane and the second plane.

18. The microfluidic delivery member of claim 13 , wherein the die includes bond pads, wherein the circuit board includes leads, the microfluidic delivery member further including conductive elements electrically coupling the bond pads of the die to the leads of the circuit board.

19. The microfluidic delivery member of claim 18 , wherein the conductive elements are conductive wires, the conductive wires including first ends coupled to the electrical contacts and second ends coupled to the leads.

20. A method of providing a lid for covering an opening of a microfluidic refill cartridge, the method comprising:

forming a first through hole in a lid;

forming a channel having a first end and a second end in an upper surface of the lid, the first end of the channel being in fluid communication with the first through hole;

securing a microfluidic delivery member to the upper surface of the lid, wherein securing includes aligning a second through hole in the microfluidic delivery member with the second end of the channel so that the first through hole and the second through hole are in fluid communication with each other by the channel, the microfluidic delivery member including a nozzle plate having a plurality of nozzles;

placing the lid on a reservoir of the microfluidic refill cartridge, wherein the reservoir is holding a fluid; and

sealing the plurality of nozzles and the second through hole from atmosphere.

21. The method of claim 20 , wherein the plurality of nozzles and the second through hole are located in different planes, and wherein sealing the plurality of nozzles and the second through hole includes using a flexible material to seal the plurality of nozzles and the second through hole.

22. The method of claim 20 , wherein sealing the plurality of nozzles and the second through hole comprises placing a strip of tape over the microfluidic delivery member to seal the plurality of nozzles and the second through hole.

23. The method of claim 20 , wherein sealing the plurality of nozzles and the second through hole comprises placing a cover over the microfluidic delivery member, the cover including a hard portion that is removably coupled to the lid and a flexible portion that is located above the plurality of nozzles and the second through hole.

24. The method of claim of claim 20 further including removing the seal to expose the plurality of nozzles and the second through hole from atmosphere.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 059246/0754 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 058835/0877 →
QUITCLAIM ASSIGNMENT Recorded Sep 8, 2021
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS S.R.L.
Reel/Frame 057437/0933 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2021
From: SCHEFFELIN, JOE; HUNT, DAVE; BURNEY, DAVID
To: STMICROELECTRONICS S.R.L.
Reel/Frame 055524/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2014
From: DODD, SIMON; SCHEFFELIN, JOE; HUNT, DAVE; BURNEY, DAVID
To: STMICROELECTRONICS, INC.
Reel/Frame 033250/0501 →