ENDOSCOPE WITH AT LEAST ONE OPTICAL SENSOR ARRANGEMENT AND METHOD FOR PRODUCING AND USING SAME
A method for producing an endoscope with an optical sensor arrangement with a distal side and a proximal side and with an electrical connection between the distal side and the proximal side. The optical sensor arrangement is mounted directly on the electrical conductor, The main feature of the invention relates to the fact that the electrical contacts, on the optical sensor, are designed so that they are arranged in a single row and that the contacts ( 11, 21 ), in this single row, are arranged with a period that corresponds to the period of the single wires found in a contact area of the electrical connection.
1 . An optical sensor arrangement for use in particular in an endoscope with a distal side and a proximal side and an electrical connection between the distal side and the proximal side,
wherein the electrical connection comprises a plurality of single wires, and
the optical sensor is mounted directly on the electrical connecting cable between the distal and the proximal side, without intermediate connection on a printed, photolithographically structured or pressed electrical circuit board.
2 . The optical sensor arrangement according to claim 1 , wherein the electrical contacts on the optical sensor are designed so that the electrical contacts are arranged in one single row and the contacts ( 11 , 21 ) in the single row are arranged with a period that corresponds to the period of the single wires found in a contact area of the electrical connection.
3 . The optical sensor arrangement according to claim 2 , wherein the contacts ( 21 ) are longer in a direction orthogonal to the row of contacts than in a direction of the row of contacts.
4 . The optical sensor arrangement according to claim 1 , wherein the electrical conductor consists of a ribbon cable with at least two separated electrical wires.
5 . A method of producing an optical sensor arrangement with an electrical conductor for use in an endoscope with a distal side and a proximal side and an electrical connection between the distal side and the proximal side, wherein the electrical connection comprises a plurality of single wires, and the optical sensor is mounted directly on the electrical connecting cable between the distal and the proximal side, without intermediate connection on a printed, photolithographically structured or pressed electrical circuit board, the method comprising the steps of:
preparing the electrical conductors during a first phase, and
applying the image sensor or camera module on the prepared conductors during a second phase.
6 . The method of producing an optical sensor arrangement according to claim 5 , further comprising the step of, during the second phase, thermally hardening adhesive enriched with electrically conductive particles and that reduces in volume when hardening is used to fix the optical sensor arrangement on the conductor.
7 . The method of producing an optical sensor arrangement according to claim 5 , further comprising the step of, during the second phase, achieving the electrical and mechanical connection between the metals of the electrical conductor and the contacts of the optical sensor arrangement by creating a durable connection by mechanical pressure and excitation with ultrasonic energy.
8 . The method of producing an optical sensor arrangement according to claim 5 , further comprising the step of plasma-activating at least one of the electrical conductor and the image sensor or camera module prior to the connecting process.
9 . The method of producing an optical sensor arrangement according to claim 5 , further comprising the step of, during the second phase, achieving the electrical and mechanical connection, between the optical sensor arrangement and the electrical conductor, by a soldering method.
10 . The method of producing an optical sensor arrangement according to claim 9 , further comprising the step of supplying the heat supply, for melting the solder, by an optical source.
11 . The method of producing an optical sensor arrangement according to claim 9 , further comprising the step of supplying the heat supply, for melting the solder, by transfer the heat from a heat source that is in mechanical contact with the electrical conductor.
12 . The method of producing an optical sensor arrangement according to claim 9 , further comprising the step of providing the heat supply, for melting the solder, by a jet of hot gas.
13 . The application of the optical sensor arrangement according to claim 1 , further comprising the step of mounting the optical sensor arrangement in an endoscope.
14 . The application of the optical sensor arrangement according to claim 1 , further comprising the step of using the optical sensor arrangement in a human body.
15 . The application of the optical sensor arrangement according to claim 1 , further comprising the step of using the optical sensor arrangement in a field of dentistry for imaging examination.