Emitter module for an LED illumination device
An illumination device comprises one or more emitter modules having improved thermal and electrical characteristics. According to one embodiment, each emitter module comprises a plurality of light emitting diodes (LEDs) configured for producing illumination for the illumination device, one or more photodetectors configured for detecting the illumination produced by the plurality of LEDs, a substrate upon which the plurality of LEDs and the one or more photodetectors are mounted, wherein the substrate is configured to provide a relatively high thermal impedance in the lateral direction, and a relatively low thermal impedance in the vertical direction, and a primary optics structure coupled to the substrate for encapsulating the plurality of LEDs and the one or more photodetectors within the primary optics structure.
1. An illumination device comprising one or more emitter modules, wherein each emitter module comprises:
a plurality of light emitting diodes (LEDs) configured for producing illumination for the illumination device;
one or more photodetectors configured for detecting the illumination produced by the plurality of LEDs;
a multiple layer substrate upon which the plurality of LEDs and the one or more photodetectors are mounted;
a primary optics structure coupled to a top surface of the multiple layer substrate for encapsulating the plurality of LEDs and the one or more photodetectors within the primary optics structure; and
a heat sink coupled to a bottom surface of the multiple layer substrate; and
wherein the multiple layer substrate comprises:
a first routing layer coupled to electrical contacts of the plurality of LEDs and the one or more photodetectors;
a first dielectric layer coupled to a bottom surface the first routing layer and configured for providing electrical isolation between the electrical contacts and the heat sink;
a second routing layer coupled to a bottom surface of the first dielectric layer and configured for routing signals between the first routing layer and external electrical contacts arranged outside of the primary optics structure; and
a second dielectric layer coupled to a bottom surface of the second routing layer and configured for providing a relatively high thermal impedance in a lateral direction, and a relatively low thermal impedance in a vertical direction.
2. The illumination device as recited in claim 1 , wherein the plurality of LEDs comprises at least four LEDs, which are mounted on the multiple layer substrate close together and arranged in an array near a center of the primary optics structure.
3. The illumination device as recited in claim 1 , wherein the plurality of LEDs comprises a red LED, a green LED, a blue LED and a white or yellow LED.
4. The illumination device as recited in claim 3 , wherein the one or more photodetectors compriseat least one of a red LED, an orange LED, or a yellow LED.
5. The illumination device as recited in claim 1 , wherein the plurality of LEDs comprise a chain of red LEDs, a chain of green LEDs, a chain of blue LEDs, and a chain of white or yellow LEDs, and wherein each chain comprises two to four LEDs of a same color.
6. The illumination device as recited in claim 5 , wherein the one or more photodetectors comprise one or more red LEDs and one or more green LEDs.
7. The illumination device as recited in claim 1 , wherein a thickness of the heat sink ranges between about 1 mm and about 10 mm.
8. The illumination device as recited in claim 1 , wherein the heat sink is formed from a material having a thermal conductivity that ranges between about 200 W/(mK) and about 400 W/(mK).
9. The illumination device as recited in claim 1 , wherein heat sink is formed from a copper, copper-alloy, aluminum, or aluminum alloy material.
10. The illumination device as recited in claim 1 , wherein a thickness of the multiple layer substrate ranges between about 300 μm and about 500 μm.
11. The illumination device as recited in claim 1 , wherein the first dielectric layer is formed from a material having a relative permittivity that ranges between about 8 and 12 and a thermal conductivity less than about 150 W/(mK), and wherein a thickness of the first dielectric layer ranges between about 10 μm and about 100 μm.
12. The illumination device as recited in claim 1 , wherein the second dielectric layer is formed from a material having a relative permittivity that ranges between about 3 and 12 and a thermal conductivity less than about 150 W/(mK), and wherein a thickness of the second dielectric layer ranges between about 100 μm and about 1000 μm.
13. The illumination device as recited in claim 1 , wherein first dielectric layer and the second dielectric layer are each formed from an aluminum nitride material or an aluminum oxide material.
14. The illumination device as recited in claim 1 , wherein the second dielectric layer provides the relatively high thermal impedance in the lateral direction by implementing the second dielectric layer with a material having a thermal conductivity less than about 150 W/(mK), and wherein the second dielectric layer provides the relatively low thermal impedance in the vertical direction by including a plurality of thermally conductive lines, which extend vertically through the second dielectric layer between the second routing layer and the heat sink.
15. The illumination device as recited in claim 14 , wherein plurality of thermally conductive lines are formed from a material having a thermal conductivity that ranges between about 200 W/(mK) and about 400 W/(mK).
16. The illumination device as recited in claim 14 , wherein the plurality of thermally conductive lines are formed from a copper, copper-alloy, aluminum, or aluminum alloy material.
17. The illumination device as recited in claim 14 , wherein each of the plurality of thermally conductive lines is formed as a plurality of densely packed, metal filled vias.
18. The illumination device as recited in claim 14 , further comprising a third routing layer coupled between the second dielectric layer and the heat sink, wherein the third routing layer extends across an upper surface of the heat sink for improving thermal contact between the plurality of thermally conductive lines and the heat sink and improving heat spreading there across.