Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
View Patent ↗An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.
1. A radio-frequency (RF) device comprising:
at least one transistor;
a package containing the at least one transistor, the package including at least one termination; and
a surface-mountable capacitor, the surface-mountable capacitor coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply, wherein a first node of the surface-mountable capacitor is coupled to a first pad on a die inside the package, the first pad comprising an RF cold point, and wherein a second node of the surface-mountable capacitor is coupled to a second pad on the die.
2. The RF device of claim 1 wherein the die includes an integrated passive device resistor, and wherein the resistor is coupled to the second pad such that the resistor is in series with the surface-mountable capacitor.
3. A radio-frequency (RF) device comprising:
at least one transistor;
a package containing the at least one transistor, the package including at least one termination; and
a surface-mountable capacitor, the surface-mountable capacitor coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply, wherein a first node of the surface-mountable capacitor is coupled to a first pad on a die inside the package, the first pad on the die comprising an RF cold point, and wherein a second node of the surface-mountable capacitor is coupled to a flange that corresponds to the power supply terminal.
4. A radio-frequency (RF) device comprising:
at least one transistor;
a package containing the at least one transistor, the package including at least one termination; and a surface-mountable capacitor, the surface-mountable capacitor coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply, wherein the surface-mountable capacitor is mounted to an interposer on a flange and inside the package, wherein the flange corresponds to the power supply terminal.
5. The RF device of claim 4 wherein the interposer comprises a printed circuit board (PCB).
6. The RF device of claim 4 wherein the surface-mountable capacitor is mounted to the interposer with at least one of conductive epoxy and solder.
7. The RF device of claim 4 wherein a first node of the surface-mountable capacitor is mounted to the interposer and wherein a second node of the surface-mountable capacitor is coupled to a second interposer on the flange.
8. The RF device of claim 4 wherein a first node of the surface-mountable capacitor is mounted to the interposer and wherein a second node of the surface-mountable capacitor is mounted directly to the flange.
9. The RF device of claim 1 wherein the package comprises at least one of an air cavity package and an over molded package.
10. The RF device of claim 1 wherein the surface-mountable capacitor comprises a first node and a second node, and wherein both the first node and the second node have solderable terminations.
11. The RF device of claim 1 further comprising a damping resistor in series with the surface-mountable capacitor.
12. The RF device of claim 3 wherein the package comprises at least one of an air cavity package and an over molded package.
13. The RF device of claim 3 wherein the surface-mountable capacitor comprises a first node and a second node, and wherein both the first node and the second node have solderable terminations.
14. The RF device of claim 3 further comprising a damping resistor in series with the surface-mountable capacitor.
15. The RF device of claim 4 wherein the package comprises at least one of an air cavity package and an over molded package.
16. The RF device of claim 4 wherein the surface-mountable capacitor comprises a first node and a second node, and wherein both the first node and the second node have solderable terminations.
17. The RF device of claim 4 further comprising a damping resistor in series with the surface-mountable capacitor.