Integrated circuit packaging system with interposer structure and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a carrier;

forming a hole into the carrier;

forming a pillar in the hole of the carrier;

forming a conductive buildup over the pillar and on a carrier first side of the carrier;

forming a molded body over the carrier and the pillar, the molded body for encapsulating the conductive buildup; and

removing the carrier for exposing the pillar.

2. The method as claimed in claim 1 further comprising forming a solder mask layer over the conductive buildup, a portion of the conductive buildup exposed from the solder mask layer.

3. The method as claimed in claim 1 wherein forming the conductive buildup includes:

forming a first trace layer in direct contact with the pillar;

forming a via directly on the first trace layer; and

forming a second trace layer over the via, the via between the first trace layer and the second trace layer.

4. The method as claimed in claim 1 wherein:

forming the pillar includes forming a pillar cavity in the pillar; and

forming the molded body includes encapsulating the pillar cavity for forming a pillar core.

5. The method as claimed in claim 1 wherein forming the pillar includes forming the pillar having a diameter of 250 μm to 350 μm.

6. The method as claimed in claim 1 further comprising attaching a base assembly to the pillar, the molded body over the base assembly.

7. The method as claimed in claim 1 further comprising;

mounting a solder structure to a component side of the base assembly; and

attaching the pillar to the solder structure.

8. The method as claimed in claim 1 wherein forming the pillar includes forming the pillar having a height over 400 μm.

9. The method as claimed in claim 1 further comprising:

attaching a base substrate to the pillar; and

mounting an integrated circuit device to the base substrate.

10. The method as claimed in claim 1 further comprising

attaching a base assembly to the pillar; and

forming a base encapsulation between the molded body and the base assembly.

11. A method of manufacture of an integrated circuit packaging system comprising:

providing a carrier;

forming a hole into the carrier;

forming a wide pillar in the hole of the carrier, the wide pillar having a diameter of 250 μm to 350 μm;

plating a conductive buildup over the wide pillar and on a carrier first side of the carrier;

forming a molded body over the carrier and in the wide pillar, the molded body for encapsulating the conductive buildup; and

removing the carrier for exposing the wide pillar.

12. The method as claimed in claim 11 wherein forming the wide pillar includes forming a pillar core in a pillar cavity of the wide pillar.

13. The method as claimed in claim 11 further comprising:

mounting a solder structure to a component side of the base assembly; and

attaching the wide pillar to the solder structure.

14. The method as claimed in claim 11 further comprising forming a solder mask layer over the conductive buildup, a portion of the conductive buildup exposed from the solder mask layer.

15. The method as claimed in claim 11 further comprising:

attaching a base substrate to the wide pillar;

mounting an integrated circuit device to the base substrate; and

forming an underfill between the base substrate and the integrated circuit device.