Multilayer ceramic electronic component and method of manufacturing the same

1. A multilayer ceramic electronic component, comprising:

a ceramic body including internal electrodes and having respective dielectric layers interposed therebetween;

an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes; and

a conductive resin layer disposed on the electrode layer and containing metal particles and a base resin,

wherein a group of the metal particles protrude from the base resin, and

a surface of the base resin first rises with respect to the ceramic body at an interface between one of the group of the metal particles and the base resin and then drops with respect to the ceramic body at a vicinity of the interface.

2. The multilayer ceramic electronic component of claim 1 , wherein when a weight ratio of metal to carbon in a surface portion of the conductive resin layer is A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is B, A/B is in a range of 1.2 or above to 2.0 or less.

3. The multilayer ceramic electronic component of claim 1 , wherein A is from 3.5 to 4.5, in which A is a weight ratio of metal to carbon in a surface portion of the conductive resin layer.

4. The multilayer ceramic electronic component of claim 1 , wherein the surface of the base resin is hardened without a polishing process.

5. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin layer has a concave-convex surface.

6. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin layer has a concave-convex surface including surfaces of metal particles exposed to an exterior of the base resin.

7. The multilayer ceramic electronic component of claim 1 , wherein the group of the metal particles are partially exposed to an exterior of the conductive base resin layer.

8. The multilayer ceramic electronic component of claim 1 , wherein the metal particles contain one or more of copper, silver, nickel, and alloys thereof.

9. The multilayer ceramic electronic component of claim 1 , wherein the metal particles comprise copper coated with silver.

10. The multilayer ceramic electronic component of claim 1 , further comprising a plating layer disposed on the conductive resin layer.

11. The multilayer ceramic electronic component of claim 10 , wherein the plating layer is in direct contact with the metal particles protruded from the base resin.

12. The multilayer ceramic electronic component of claim 1 , wherein the ceramic body has a length of 300 μm to 700 μm and a width of 150 μm to 400 μm.

13. A method of manufacturing a multilayer ceramic electronic component, the method comprising:

forming a ceramic body including dielectric layers and internal electrodes;

forming an electrode layer on an end surface of the ceramic body electrically connected to one ends of the internal electrodes;

applying, onto the electrode layer, a conductive resin composition containing metal particles, a solid-phase resin present in a solid phase at room temperature, and a liquid-phase resin present in a liquid phase at room temperature; and

forming a conductive resin layer including the metal particles and a base resin by curing the conductive resin composition,

wherein during the process that the conductive resin cures, the liquid-phase volatilizes, thereby portions of the metal particles protrude from the base resin.

14. The method of claim 13 , wherein the conductive resin composition contains 50 to 70 parts by weight of the liquid-phase resin based on 100 parts by weight of a sum of the solid-phase resin and the liquid-phase resin.

15. The method of claim 13 , wherein when a weight ratio of metal to carbon in a surface portion of the conductive resin layer is A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is B, A/B is in a range of 1.2 or above to 2.0 or less.

16. The method of claim 13 , wherein a weight ratio A of metal to carbon in a surface portion of the conductive resin layer is from 3.5 to 4.5.

17. The method of claim 13 , wherein the conductive resin layer has a concave-convex surface.

18. The method of claim 13 , wherein the conductive resin layer has a concave-convex surface including surfaces of metal particles exposed to an exterior of the base resin.

19. The method of claim 13 , wherein the portions of the metal particles are partially exposed to an exterior of the conductive resin layer, and a surface of the base resin rises at interfaces between the base resin and the protruding metal particles by a predetermined height to partially enclose the protruding metal particles.

20. A multilayer ceramic electronic component, comprising:

a ceramic body including internal electrodes and dielectric layers;

an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes; and

a conductive resin layer disposed on the electrode layer and containing metal particles and a base resin,

wherein portions of the metal particles protrude from the base resin, thereby being partially exposed to an exterior of the base resin, and

AB is from 1.2 to 2.0, in which A is a weight ratio of metal to carbon in a surface portion of the conductive resin layer and B is a weight ratio of metal to carbon in an internal portion of the conductive resin layer.

21. The multilayer ceramic electronic component of claim 20 , wherein the conductive resin layer has a concave-convex surface.

22. The multilayer ceramic electronic component of claim 20 , wherein the conductive resin layer has a concave-convex surface including surfaces of the metal particles exposed to the exterior of the conductive base resin.

23. The multilayer ceramic electronic component of claim 20 , wherein A is from 3.5 to 4.5.