Methods of forming structures
Some embodiments include methods of forming structures. Spaced-apart features are formed which contain temperature-sensitive material. Liners are formed along sidewalls of the features under conditions which do not expose the temperature-sensitive material to a temperature exceeding 300° C. The liners extend along the temperature-sensitive material and narrow gaps between the spaced-apart features. The narrowed gaps are filled with flowable material which is cured under conditions that do not expose the temperature-sensitive material to a temperature exceeding 300° C. In some embodiments, the features contain memory cell regions over select device regions. The memory cell regions include first chalcogenide and the select device regions include second chalcogenide. The liners extend along and directly against the first and second chalcogenides.
1. A method of forming structures, comprising:
forming spaced-apart features containing memory cell regions; the memory cell regions comprising phase change material;
forming liners along sidewalls of the features under conditions which do not expose the phase change material to a temperature exceeding 300° C.; the liners extending along and directly against the phase change material; the liners narrowing gaps between the spaced-apart features;
filling the narrowed gaps with flowable material and curing the flowable material under oxidative conditions which do not expose the phase change material to a temperature exceeding 300° C.; and
wherein the liners comprise a laminate of an aluminum-containing material and silicon nitride, with the silicon nitride being directly against the sidewalls of the features.
2. The method of claim 1 wherein the aluminum-containing material is aluminum oxide.
3. The method of claim 1 wherein the liners have a substantially uniform thickness along an entirety of a height of individual sidewalls.
4. The method of claim 1 wherein the flowable material is spin-on dielectric.
5. The method of claim 1 wherein the flowable material comprises polysilazane.
6. The method of claim 1 wherein the flowable material comprises perhydropolysilazane, and further comprising curing the flowable material at a temperature within a range of from about 80° C. to about 250° C.
7. A method of forming structures, comprising:
forming spaced-apart features containing memory cell regions over select device regions; the memory cell regions comprising first chalcogenide and the select device regions comprising second chalcogenide;
forming liners along sidewalls of the features under conditions which do not expose the first and second chalcogenides to a temperature exceeding 300° C.; the liners extending along and directly against the first and second chalcogenides; the liners narrowing gaps between the spaced-apart features;
filling the narrowed gaps with flowable material and curing the flowable material under oxidative conditions which do not expose the first and second chalcogenides to a temperature exceeding 300° C.; and
wherein the liners comprise a laminate of aluminum oxide and silicon nitride, with the silicon nitride being directly against the sidewalls of the features.
8. The method of claim 7 wherein the liners have a substantially uniform thickness along an entirety of a height of individual sidewalls.
9. The method of claim 7 wherein the flowable material is spin-on dielectric.
10. The method of claim 7 wherein the flowable material comprises polysilazane.
11. The method of claim 7 wherein the flowable material comprises perhydropolysilazane, and further comprising curing the flowable material at a temperature within a range of from about 80° C. to about 250° C.