Multilayer electronic component
A multilayer electronic component includes a ceramic body including a plurality of insulating layers; an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the insulating layers are connected to each other; and a first external electrode connected to first lead parts of the first and second internal coil patterns, and a second external electrode connected to second lead parts of the first and second internal coil patterns, wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other and are connected to each other in parallel, and the via electrodes are disposed such that a plurality of via electrodes configure a single connection terminal.
1. A multilayer electronic component comprising:
a ceramic body including a plurality of insulating layers;
an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the plurality of insulating layers are connected to each other by via electrodes penetrating through the insulating layers; and
a first external electrode disposed on at least one surface of the ceramic body and connected to first lead parts of the first and second internal coil patterns, and a second external electrode disposed on at least one surface of the ceramic body and connected to second lead parts of the first and second internal coil patterns,
wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other,
the first and second internal coil patterns are connected to each other in parallel,
the via electrodes are disposed such that a plurality of the via electrodes configure a single connection terminal,
at least one pair of the first and second internal coil patterns adjacent to each other are connected by four or more of the via electrodes, and
two of the four or more via electrodes connect with and overlap two of the via electrodes which are located thereabove.
2. The multilayer electronic component of claim 1 , wherein the internal coil part includes the first and second internal coil patterns disposed in n−1-th and n-th positions (n indicates a multiple of 2), respectively, based on an uppermost internal coil pattern among the internal coil patterns.
3. The multilayer electronic component of claim 2 , wherein the first and second internal coil patterns disposed in the n−1-th and n-th positions, respectively, have shapes corresponding to each other.
4. The multilayer electronic component of claim 1 , wherein the connection terminal includes two or three via electrodes.
5. The multilayer electronic component of claim 1 , wherein the first and second internal coil patterns that are not connected to the first and second external electrodes are connected to each other in parallel by a plurality of connection terminals.
6. The multilayer electronic component of claim 1 , wherein the internal coil part is disposed to be closer to an upper surface of the ceramic body in a thickness direction thereof, as compared to a lower surface of the ceramic body in the thickness direction thereof.
7. The multilayer electronic component of claim 1 , wherein the first and second internal coil patterns are disposed to be perpendicular to an upper surface or a lower surface of the ceramic body in a thickness direction thereof.
8. The multilayer electronic component of claim 7 , wherein the first and second lead parts of the first and second internal coil patterns are exposed to the lower surface of the ceramic body in the thickness direction thereof, and the first and second external electrodes are disposed on the lower surface of the ceramic body in the thickness direction thereof.
9. A multilayer electronic component comprising:
a ceramic body including a plurality of insulating layers;
an internal coil part disposed in the ceramic body; and
a first external electrode disposed on at least one surface of the ceramic body and connected to a first lead part of the internal coil part and a second external electrode disposed on at least one surface of the ceramic body and connected to a second lead part of the internal coil part,
wherein the internal coil part is formed by stacking a plurality of double internal coil patterns disposed on the insulating layers adjacent to each other and having shapes corresponding to each other,
the respective internal coil patterns disposed on the adjacent insulating layers are connected to each other by a connection terminal including a plurality of via electrodes penetrating through the insulating layers,
at least one pair of the internal coil patterns adjacent to each other are connected by four or more of the via electrodes, and
two of the four or more via electrodes connect with and overlap two of the via electrodes which are located thereabove.
10. The multilayer electronic component of claim 9 , wherein the double internal coil patterns include first and second internal coil patterns disposed in n−1-th and n-th positions (n indicates a multiple of 2), respectively, based on an uppermost internal coil pattern of the internal coil part.
11. The multilayer electronic component of claim 10 , wherein each of the first and second internal coil patterns has the first lead part to be connected to the first external electrode, while each of the first and second internal coil patterns has the second lead part to be connected to the second external electrode.
12. The multilayer electronic component of claim 10 , wherein first and second internal coil patterns that are not connected to the first and second external electrodes and are disposed in the n−1-th and n-th positions (n indicates a multiple of 2), respectively, among the first and second internal coil patterns are connected to each other in parallel by a plurality of connection terminals.
13. The multilayer electronic component of claim 9 , wherein the connection terminal includes two or three via electrodes.
14. The multilayer electronic component of claim 9 , wherein a central axis of the internal coil part is disposed to be parallel to an upper surface or a lower surface of the ceramic body in a thickness direction thereof.
15. The multilayer electronic component of claim 14 , wherein the first and second lead parts of the internal coil part are exposed to the lower surface of the ceramic body in the thickness direction thereof, and the first and second external electrodes are disposed on the lower surface of the ceramic body in the thickness direction thereof.
16. A multilayer electronic component comprising:
a ceramic body including a plurality of insulating layers;
a plurality of internal coil patterns disposed on the plurality of insulating layers; and
a connection terminal connecting internal coil patterns disposed on the insulating layers adjacent to each other, among the internal coil pattern, to form an internal coil part,
wherein first and second internal coil patterns disposed in n−1-th and n-th positions (n indicates a multiple of 2), respectively, based on an uppermost internal coil pattern among the plurality of internal coil patterns, have shapes corresponding to each other and are connected to each other in parallel,
the connection terminal includes a plurality of via electrodes penetrating through the insulating layers,
at least one pair of the first and second internal coil patterns adjacent to each other are connected by four or more of the via electrodes, and
two of the four or more via electrodes connect with and overlap two of the via electrodes which are located thereabove.
17. The multilayer electronic component of claim 16 , further comprising a first external electrode disposed on at least one surface of the ceramic body and connected to first lead parts of the first and second internal coil patterns, and a second external electrode disposed on at least one surface of the ceramic body and connected to second lead parts of the first and second internal coil patterns.
18. The multilayer electronic component of claim 16 , wherein the first and second internal coil patterns are disposed to be perpendicular to an upper surface or a lower surface of the ceramic body in a thickness direction thereof.
19. The multilayer electronic component of claim 18 , wherein the first and second lead parts of the first and second internal coil patterns are exposed to the lower surface of the ceramic body in the thickness direction thereof, and
a first external electrode connected to first lead parts of the first and second internal coil patterns and a second external electrode connected to second lead parts of the first and second internal coil patterns are disposed on the lower surface of the ceramic body in the thickness direction thereof.
20. The multilayer electronic component of claim 1 , wherein the other two of the four or more via electrodes connect and overlap two of the via electrodes which are located therebelow.