Modular architecture for scalable phased array radars
In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.
1. A radar radiator panel, comprising:
a radome;
cyanate ester quartz (CEQ) coupled to the radome; and
a stacked assembly coupled to the CEQ, the stacked assembly comprising a thermal conductive layer configured to facilitate a transfer of heat to the radome,
wherein the stacked assembly further comprises:
an epoxy;
a multi-layer RF circuit card; and
foam between the multi-layer circuit card and the thermal conductive layer.
2. The radiator panel of claim 1 , wherein the thermal conductive layer comprises at least one of aluminum or copper.
3. The radiator panel of claim 1 , wherein the thermal conductive layer is about 60 mils.
4. A radar radiator panel, comprising:
a radome;
cyanate ester quartz (CEQ) coupled to the radome; and
a plurality of stacked assemblies coupled to the CEQ, each stacked assembly comprising a thermal conductive layer configured to facilitate a transfer of heat to the radome,
wherein each stacked assembly further comprises:
an epoxy;
a multi-layer RF circuit card; and
foam between the multi-layer circuit card and the thermal conductive layer.
5. The radiator panel of claim 4 , wherein the thermal conductive layer comprises at least one of aluminum or copper.
6. The radiator panel of claim 4 , wherein the thermal conductive layer is about 60 mils.
7. The radiator panel of claim 4 , further comprising a housing comprising a plurality of cavities,
wherein each of the stacked assemblies fills a respective one cavity of the plurality of cavities.