Self-powered piezoelectric energy harvesting microsystem

1. A method of forming a self-powered piezoelectric energy harvesting microsystem, comprising:

forming integrated circuit elements including transistor gate structures and source/drain regions using CMOS processing steps at a proof mass first portion of a die region of a semiconductor wafer substrate;

depositing and patterning dielectric layers and metal layers at the first portion of the die region to form contacts and interconnections for the integrated circuit elements;

depositing and patterning first electrode, piezoelectric material and second electrode layers at a beam second portion of the die region to form piezoelectric energy harvesting unit components connected to the integrated circuit elements;

etching fully through the substrate to form a support frame third portion of the die region separated by a gap from a majority of the first portion and joining by the second portion to a minority of the first portion;

etching partially through the substrate to thin the second portion; and

providing a battery connected to the integrated circuit elements at the first portion of the die region.

2. The method of claim 1 , wherein the integrated circuit elements are formed at a first region of the first portion, and the battery is provided at a second region laterally spaced from the first region of the first portion.

3. The method of claim 2 , wherein the third portion is separated by a gap along three sides of the first portion and joined by the second portion along a fourth side of the first portion.

4. The method of claim 3 , wherein the battery is provided at an end of the first portion laterally distal from the fourth side of the first portion.

5. A self-powered piezoelectric energy harvesting microsystem device, comprising:

integrated circuit elements, including transistor gate structures and source/drain regions formed using CMOS processing steps, located at a proof mass portion of a die region of a semiconductor wafer substrate;

contacts and interconnections for the integrated circuit elements formed by dielectric layers and metal layers over the proof mass portion of the die region;

piezoelectric energy harvesting unit components connected to the integrated circuit elements formed by first electrode, piezoelectric material and second electrode layers at a beam portion of the die region; and

a battery provided on the proof mass portion connected to the integrated circuit elements;

wherein the die region includes a support frame portion separated by a gap from a majority of the proof mass portion; the beam portion has a thickness less than the proof mass and support frame portions and joins a minority of the proof mass portion to the support frame portion.

6. The device of claim 5 , wherein the integrated circuit elements are provided at a first region of the proof mass portion; and the battery is provided at a second region of the proof mass portion laterally spaced from the first region.

7. The device of claim 6 , wherein the device has a cantilever structural configuration with the proof mass portion separated by a gap from the support frame portion along three sides of the proof mass portion, and the beam portion joining the proof mass portion to the support frame portion along a fourth side of the proof mass.

8. The device of claim 7 , wherein the battery is located adjacent a side of the proof mass portion which is opposite to the fourth side of the proof mass portion.

9. The device of claim 8 , wherein the die region is a singulated die region defining a die.