Grapho-epitaxy DSA process with dimension control of template pattern
A method for defining a template for directed self-assembly (DSA) materials includes patterning a resist on a stack including an ARC and a mask formed over a hydrophilic layer. A pattern is formed by etching the ARC and the mask to form template lines which are trimmed to less than a minimum feature size (L). Hydrophobic spacers are formed on the template lines and include a fractional width of L. A neutral brush layer is grafted to the hydrophilic layer. A DSA material is deposited between the spacers and annealed to form material domains in a form of alternating lines of a first and a second material wherein the first material in contact with the spacers includes a width less than a width of the lines. A metal is added to the domains forming an etch resistant second material. The first material and the spacers are removed to form a DSA template pattern.
1. A method for defining a template for directed self-assembly (DSA) materials, comprising:
forming a template pattern on a stack, the stack including an anti-reflection coating (ARC) and a mask layer formed over a hydrophilic layer;
forming the stack into template lines and exposing portions of the hydrophilic layer underneath the stack;
forming hydrophobic spacers on sidewalls of the template lines;
grafting a neutral brush layer to exposed portions of the hydrophilic layer;
depositing a DSA material between the spacers of the template lines and causing the DSA material to form material domains in a form of alternating lines of a first material and a second material, wherein the first material being in contact with the spacers includes a fractional size width less than a width of the lines;
making the second material etch resistant; and
removing the first material and the spacers to form a DSA template pattern for etching underlying materials.
2. The method as recited in claim 1 , wherein the hydrophilic layer includes a silicon anti-reflection coating (SiARC).
3. The method as recited in claim 1 , further comprising trimming the template lines to less than a minimum feature size achievable by lithography.
4. The method as recited in claim 1 , wherein the template lines include a width of about 0.5L, the spacers includes a width of about 0.25L and the first material in contact with the spacers includes a width of about 0.25L, where L is the minimum feature size.
5. The method as recited in claim 1 , wherein the DSA template pattern includes lines having a width of about 0.5L, and spaces between the lines having a width of about 0.5L.
6. The method as recited in claim 1 , wherein forming hydrophobic spacers includes depositing an organic material and reactive ion etching the organic material to form the spacers.
7. The method as recited in claim 1 , wherein depositing a DSA material includes depositing a block copolymer material.
8. The method as recited in claim 7 , wherein depositing the block copolymer material includes depositing one of a poly(styrene)-block-poly(methyl methacrylate) diblock copolymer (PS-b-PMMA)) and a poly(styrene)-block-poly(hydroxystyrene) diblock copolymer (PS-b-PHOST).
9. The method as recited in claim 1 , wherein making the second material etch resistant includes adding a metal by atomic layer depositing one of Ti or Al.
10. The method as recited in claim 1 , wherein the template lines include a same line width and spacing as the lines and spaces in the DSA template pattern.
11. A method for defining a template for directed self-assembly (DSA) materials, comprising:
forming a template pattern on a stack, the stack including an anti-reflection coating (ARC) and a mask layer formed over a hydrophilic layer;
forming the stack into template lines and exposing portions of the hydrophilic layer underneath the stack;
forming hydrophobic spacers on sidewalls of the template lines;
grafting a neutral brush layer to exposed portions of the hydrophilic layer;
depositing a DSA material between the spacers of the template lines;
annealing the DSA material to form material domains in a form of alternating lines of a first material and a second material, the lines having a fractional width of L, wherein the first material in contact with the spacers includes a width of about one half the fractional width, where L is a minimum feature size achievable by lithography;
adding a metal to the alternating material domains to form an etch resistant material with the second material; and
removing the first material and the spacers to form a DSA template pattern for etching underlying materials.
12. The method as recited in claim 11 , wherein the hydrophilic layer includes a silicon anti-reflection coating (SiARC).
13. The method as recited in claim 11 , wherein the DSA template pattern includes spaces between the lines having a width of about 0.5L.
14. The method as recited in claim 11 , wherein forming hydrophobic spacers includes depositing an organic material and reactive ion etching the organic material to form the spacers.
15. The method as recited in claim 11 , wherein depositing a DSA material includes depositing a block copolymer material.
16. The method as recited in claim 15 , wherein depositing the block copolymer material includes depositing one of a poly(styrene)-block-poly(methyl methacrylate) diblock copolymer (PS-b-PMMA)) and a poly(styrene)-block-poly(hydroxystyrene) diblock copolymer (PS-b-PHOST).
17. The method as recited in claim 11 , wherein adding a metal includes atomic layer depositing one of Ti or Al.
18. The method as recited in claim 11 , wherein the template line includes a same line width and spacing as the lines and spaces in the DSA template pattern.
19. The method as recited in claim 11 , further comprising trimming the template lines to less than a minimum feature size achievable by lithography.
20. The method as recited in claim 11 , wherein the fractional width is about 0.5L, wherein the first material in contact with the spacers includes a width of about 0.25L.