Heat Exchanger for Electronic Assemblies
A liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.
1 - 11 . (canceled)
12 . A method of making a heat exchanger for electronic assemblies, comprising:
a) extruding a solid heat-conductive plate having a length, a width and a thickness, with a plurality of parallel longitudinal passages enclosed in the thickness along the length of the plate;
b) drilling a plurality of parallel transverse passages drilled across at least part of the width, perpendicular to the plurality of longitudinal passages, such that each transverse passage intersects at least two longitudinal passages;
c) inserting a plurality of plugs for blocking fluid flow into the plurality of longitudinal passages and the plurality of transverse passages, the plugs being located such that fluid is constrained to flow from a fluid inlet at an end of a longitudinal passage or a transverse passage through the plurality of longitudinal passages and the plurality of transverse passages to a fluid outlet at an end of a longitudinal passage or a transverse passage.
13 . The method of claim 12 , further comprising sealing an open end of at least one longitudinal passage or transverse passage.
14 . The method of claim 12 , further comprising installing a connector at the fluid input and at the fluid output.
15 . The method of claim 12 , further comprising mounting an electronic assembly to the base plate.
16 . The method of claim 12 , further comprising cutting the base plate to a determined length.
17 . The method of claim 12 , in which the plate is formed with a base plate and a side wall forming an L-shaped heat exchanger.
18 . The method of claim 12 , in which the plate is formed with a base plate and two side walls forming a U-shaped heat exchanger.